Copper, Iron, Zirconium manufacturer / supplier in China, offering Titanium Sputtering Target, Cumnni Sputtering Target, 3n5 Eb Melting Thin Film Coating Material Hafnium Target and so on.
Min. Order / Reference FOB Price | |
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1 Piece | US $100.00/ Piece |
Local Area: | Changsha, Hunan, China |
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R&D Capacity: | OEM, ODM, Other |
Payment Terms: | LC, T/T, PayPal, WesternUnion |
Certification: | ISO |
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Certificate: | TUV/SGS/Ce/RoHS |
Sample: | Provide |
Since 2014
Specializing in high purity sputtering Electronic Instrument targets.
Leader manufacturer of sputtering materials in China.
Qualified the world certificates such as ISO9001:2008 and SGS.
Comprehensive in R&D, manufacturing, and sales on thin film materials.
Export to more than 15 countries in Europe, Southeast Asia, South America and areas, etc.
OUR ADVANTAGE1,Many years manufacturing & exporting experience.2 Strict & complete QC systerm3,Perfect after sale systermChemical Composition: pure gold
Available Purity: 4N-5N
Production Technology: EB melting
Shapes: planar targets, rotary targets
Average Grain Size: <100um
Silver is a kind of precious materials.
Gold sputtering targets is a very important materials of semiconductor, it's used for depositing gold thin film on the surface of semiconductor chips, to form ohmiccontact film, electrode or other films, it can form various metallic films system. Most of gold oxide film system can be usPower Tools ed for manufacturing LED, microwave communication device, widely applied in spaceflight,aviation, semiconductor chips and Solar Cells.
COMPANYPROFILE:
Since 2014
Specializing in high purity sputtering targets.
Leader manufacturer of sputtering materials in China.
Qualified the world certificates such as ISO9001:2008 and SGS.
Comprehensive in R&D, manufacturing, and sales on thin film materials.
Export to more tHand Tools han 15 countries in Europe, Southeast Asia, South America and areas, etc.
OUR PRODUCTEnvironment Protection Device S *metal Target : W, Mo, Ta, Nb, Cu, V, Ni, Ti, Fe, Al ,Zr, Co, Au, Ag, Pt, etc.*Alloy Target :NiFe,NiCr,NiV,CuNi,TiAl,CoCr,CoFe, WTi, CoTaZr,CuInGa, ZnSn,CuZn, etc*CeramicTarget : TiO2,Al2O3,Ta2O5, ZrO2,SiC,SiO,SiO2, ITO, GZO, AZO, WS2,MoS2,Ga2O3,HfO2,etc*EvaporationMaterials : Crucible,Pellets,Granules,Pieces,etc*Backing Plate: Cu, Mo, SS,etc*Bonding Service: Indium, Elastomer