Business Type:
Manufacturer/Factory
Business Range:
XPE Foam, IXPE Foam, Mat, Surfboard, Sporting Goods, ESD Foam
Establishment:
2002
R&D Capacity:
ODM, OEM
Terms of Payment:
T/T, PayPal
Main Markets:
Southeast Asia, Middle East, Australia, Domestic
OEM/ODM Service
Sample Available

Foam Tape, Thin Foam Tape, Super Thin Foam manufacturer / supplier in China, offering 0.5mm, 1mm, 2mm 3mm Super Thin Gasket Seal Liner Medical Foam Tape Polyethylene PE Foam, Physically Cross Linked Polyethylene Foam Sound Absorption for Wall Insulation, Crosslinked PE/ XPE/IXPE Insulation & Waterproof Foam and so on.

1
    YRS
General Supplier

Antistatic Foam ESD IXPE Foams Packing Foam

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Min. Order / Reference FOB Price
1 Pieces Contact Supplier
Local Area: Shenzhen, Guangdong, China
R&D Capacity: OEM, ODM, Other
Payment Terms: T/T, PayPal
Material: Polyethylene/PE
Usage: General Plastics, Engineering Plastics
Color: All Kinds
1. Product description
Anti-static foam is produced by compounding PE with some special padding and foaming material,
Then cross linkinked by foaming. The conductivity IXPE foam is a hi-tech ESD product which has
Very good anti-static property, it is an ideal packing material for optoelectronic devices and
Microelectronics devices, integrated circuit, printed circuit board, communications, military products etc.Conductive polyethylene foam resolves antistatic problems. It is a high
Performance cushioning foam; It also provides conductive properties important to
Sensitive electronic parts and products. Conductive polyethylene foam is resistant to
Change in heat and temperature caused by the external environment. It prevents
Damage caused by static electricity by providing conductivity suitable for each kind of
Semiconductor.
The dimension can be designed by customers' requirements, for optoelectronic devices,
Microelectronic devices packaging, and its anti-static property will not be changed for
Postprocessing.Conductive PE foam tray
Conductive polyethylene foam tray can be divided into several kind as below
According to its usage
A. Conductive Foam packing tray is used for packing or conveying of high-end components, integrated circuit and printed circuit board.
B. Conductive Foam turnover tray is used for IC products for packing or shipment.
C. Conductive Foam blister tray with fine appearance, is used for packing and conveying
Of communications or military products in the workshop or shipment.Features:
1. Static dissipative;
2. Chemical corrosion resistance;
3. Excellent permanent ESD effect, excellent conductive effect:
Resistivity value 103-109 Ω /sq;
4. Superior buffering and cushioning performance;
5. Moistureproof, heat insulation;
6. Friendly environmentally, non-toxic, no odor;
7. Good performance, can be processed to various shapes by customer's requirements.
7. Intrinsic conductive path/network, excellent anti-static performance;
8. Without the use of environmental humidity can make electrostatic quickly leaked, anti-static property isn't affected by environmental humidity;
9. Long term anti-static.
2. Advantages
1. Medium and high quality are often customized to meet different market.
2. High Cost effective
3. High fire resistance
4. Good after-sale service
5. Strong capacity: One day one container
6. OEM service, 12 years manufacture experience, sample in stock can be offered in one working day
3. Our services
Factory direct selling with low price, sooner leadtime, customized service.4. Comany info
CYG TeFa Co., Ltd has 12 years experience of producting XPE & IXPE foam. We're the biggest and the most professional irradiation crosslinked polyethylene conductive foam manufacturer in China and has the most complete crosslinked polyethylene foam products. Our main products are Crosslinked PE foam material, IXPE foam, XPE foam, Conductive IXPE foam; ESD foam tray, ESD packing material; Beach mat, camping mat, sleeping mat, yoga mat; Etc.about ours
14years history for producing Foam.
3 production bases in China
10 production lines.
Customers: Huawei, ZTE, Samsung, Foxconn, Flextronics and other well-know electronic and communications enterprises.5. Application Field:
An ideal packing material for optoelectronic devices, integrated circuit, printed circuit board, communications, military products etc.
Item
Unit
Conductivetype
A nti-statictype
Surfaceresistivity
?/square
10 3 _ 10 6
10 6 _ 109
Volume resistivity
? .cm
10 3 _ 10 6
10 6 _ 109
Tensilestrength
MPa
> 0.5
> 0.5
Elongation
%
> 150
> 150
TearingStength
N/mm
> 1.2
> 1.2
C olor
B lack
B lack
D ensity
Kg/m 3
30-45
30-45
ElectrostaticAttenuatingtime
S
<0.5
<.5
AbrasivePotential
V
<100
<100