4 Layers Rigid Flex PCB Circuit Board Flex-Rigid Pressfit PCB for Industry Control

4 Layers Rigid Flex PCB Circuit Board Flex-Rigid Pressfit PCB for Industry ControlCommodity IntroductionThis is atype of rigid-flexible PCB for the application of Wireless Security System. It's a4 layer rigid-flex PCB at 1.6mm thick at rigid part. The base laminate is from Shengyi. It's fabricated per IPC 6012 Class 2using supplied Gerber data.
Parameter &Data SheetSize of Flexible PCB71.25 X80.38Number of Layers4Board TypeRigid-Flexible PCBBoard Thickness0.25mmBoard MaterialPolyimide (PI) 25µmBoard Material SupplierITEQTg Value of Board Material60ºCPTH Cu thickness≥20 µmInner Iayer Cu thicknes35 µm (1oz)Surface Cu thickness35 µm (1oz)Coverlay ColourBlackNumber of Coverlay2Thickness of Coverlay25 µmStiffener MaterialFR-4 /Stainless steelStiffener Thickness1.0mm /0.2mmType of Silkscreen InkIJR-4000 MW300Supplier of SilkscreenTAIYOColor of SilkscreenWhiteNumber of Silkscreen1Peeling test of CoverlayNo peelableLegend Adhesion3M 90ºC No peeling after Min. 3times testSurface FinishImmersion GoldThickness of Nickle/GoldAu: 0.03µm(Min.); Ni 2-4µmRoHS RequiredYesFamability94-V0Thermal Shock TestPass, -25ºC±125ºC, 1000 cycles.Thermal StressPass, 300±5ºC,10 seconds, 3cycles.
No delamination, no blistering.Function100% Pass electrical testWorkmanshipCompliance with IPC-A-600H &IPC-6013C Class 2Rigid-Flex PCB CapabilityRigid-FlexPCB's are thermal management circuit boards which use aFlexible material as the heat radiator part of the PCB. They are used in high heat generating application like LED lighting in the area of high power LED lighting, Automotive Interior, Exterior Lighting, Parking Garage Lighting, LED spot light etc. The metal core can be aluminum (aluminum core PCB) and copper (copper core PCB). The most common used aluminum core PCB is the thermal conductivity at 1W/MK and 2W/MK.NO.ParameterValue1Type of MaterialFlex,FR42Material BrandTaiflex,shengyi3Surface FinishHASL, Immersion Gold, Immersion Silver,
OSP4Thickness of Surface platingHASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm5Layer Count1-4 Layers6Maximum of Board Size23" x46" (584mmx1168mm)7Mininum of Board Size0.1969" x0.1969" (5mmx5mm)8Board Thickness0.0157" x0.2362" (0.4-6.0mm)9Copper Thickness0.5OZ(17.5µm),1OZ(35µm),2OZ(70µm),
3OZ(105µm),4OZ(140µm)10Minimum Track Width5mil (0.127mm)11Minimum Space5mil (0.127mm)12Minimum Hole Size0.0197" (0.5mm)13Maximum Hole SizeNo limit14Minimum Holes PunchedPCB thickness <1.0mm: 0.0394" (1.0mm)PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)15PTH Wall Thickness>20µm16Tolerance of PTH±0.00295" (0.075mm)17Tolerance of NPTH±0.00197" (0.05mm)18Deviation of Hole Position±0.00394" (0.10mm)19Outline ToleranceRouting: ±0.00394" (0.1mm)Punching: ±0.00591" (0.15mm)20Angle of V-cut30°, 45°, 60°21V-cut Size0.1969" x47.24" (5mmx1200mm)22Thickness of V-cut Board0.0236" x0.1181" (0.6-3mm)23Tolerance of V-cut Angle±5º24V-CUT Verticality≤0.0059" (0.15mm)25Minimum Square Slots PunchedPCB thickness <1.0mm: 0.0315" x0.0315"
(0.8 x0.8mm)PCB thickness 1.2-3.0mm: 0.0394" x0.0394"
(1.0 x1.0mm)26Minimum BGA PAD0.01378" (0.35mm)27Minimum Width of Solder Mask Bridge.8mil (0.2032mm)28Minimum Thickness of Solder Mask>13µm (0.013mm)29Insulation Resistance1012ΩNormal30Peel-off Strength2.2N/mm31Solder float260ºC 3min32E-test Voltage50-250V33Thermal Conductivity0.8-8W/M.K34Warp or Twist≤0.5%35FlammabilityFV-036Minimum Height of Component indicator0.0059"(0.15mm)37Minimum Open Solder Mask on Pad0.000394" (0.01mm)
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