BGA Rework Station IR Preheating Plate oven T-8120
Technical parameters
Power: 300W
Voltage: AC110V-220V 50/60Hz
Infrared lamp body power: 100W
Infrared lamp body heating size: 35*35mm
Infrared lamp body temperature range: 0-350
FEATURES
1. Adopt hand-held lamp structure with flexible operation and easy control. T835 is suitable for all-dimensional flat components, especially BGA, SMD components.
2. Infrared lamp heating, heat is easy to pierce and distribute evenly, which overcomes disadvantages (burn out elements) of traditional soldering machines.
3. Infrared heating don't have hot air flow. Don't impact circumjacent small elements. It is suitable for all of the elements. It can be used to unsolder BGA, SMD, CSP, LGA, QFP and PLCC, especially Micro BGA and SMD elements. T835 works together with preheating oven T-8120, which can repair all kinds of needle-socket (such as CPU socket and inserted row GAP).
4. Easy operate. Just need one-day training, you can operate it skillfully. Don't need any welding tools. This machine can solder all the flat components.
5. T-835 will satisfy soldering/unsoldering of phones, computers, notebooks, play station machines, etc.