Business Type:
Manufacturer/Factory
Business Range:
SMC, BMC, G10/FR4 Laminate, FRP, Composite Material, Insulating Material, GRP, Mica ..
Establishment:
2009
R&D Capacity:
ODM, OEM
OEM/ODM Service
Sample Available

Black Durostone Pallet, Circuit Board Material, Composite manufacturer / supplier in China, offering Solder Pallet at The Lowest Price, Unclad Epoxy Glass Fabric Laminate Fr4, Hot Sale Mica Plate/Sheet with Factory Cheapest Price and so on.

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Supplier Homepage Electrical & Electronics Insulation China Black PCB Solder Pallet Material with The Best Quality

China Black PCB Solder Pallet Material with The Best Quality

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Min. Order / Reference FOB Price
10 kg Contact Supplier
Local Area: Beijing, China
R&D Capacity: OEM, ODM, Other
Payment Terms: LC, T/T, PayPal
Brand: RDS
Application: Electrical Base, Shell, Motor
Type: Insulation Sheet
Material: Fiberglass & Resin

Black PCB Solder Pallet Material With The Best Quality

Black solder pallet is a heavy-duty glass fiber reinforced plastic which offers extreme strength and excellent electrical, thermal and chemical properties. It is manufactured by using Polyester, Vinyl ester, Epoxy- and modified Epoxy resins combined with glass fibers.
It can keep its mechanical strength, smoothness and original color when continuously used under the temperature of 280 ° C (max. Working temperature below 360 degree 10~20sec). It is easily machining, high intensity and can be easily machining into special mechanical parts.
Application
Black solder pallet is suitable to wave soldering and SMT process. It can achieve the precision required during the SMT machining process, and maintain its flatness in the reflow soldering cycle. The low thermal conductivity of the solder pallet prevents heat-shrinkage of the bas board, to ensure the quality of reflow process. It is designed and typically recommended for use in manufacturing solder pallets for wave-solder applications of printed circuit boards.
The fixtures made from solder pallet has the following functions, it can improve the efficiency of the peak soldering process:
Support thin baseboard or soft substrate circuit board
Carry an irregular shape solder pallet.
Use multi-pak panel design to improve production efficiency
Prevent the deformation of the solder pallet during high temperature reflow soldering process
Smoothly surface, good endurance, applicable for Teflon spray painting.
Avoid gold finger contamination by human contact.
Protect bottom side SMT components during the wave soldering process.
Prevent the deformation of the baseboard during the wave soldering process
Standardized the width of the production lines, eliminate the width adjustment of the production line

Technical DataRDS-001RDS-002RDS-003Grade Standard Anti-staticAnti-static and OpticalColorBlack Black GreyDensity(g/cm3 )1.871.871.87Flexural Strength(MPa)-perpendicular 3 point support(23°C)360360360Flexural Strength(MPa)-perpendicular 3 point support(150°C)180180180Coefficient of Linear Expansion(10 -6 / K)between30°C&200°C131111Thermal Conductivity(W/m 0 K)0.250.250.25Surface Resistivity(ohms)____10 5 -10 810 6 -10 8Standard Operating Temperature(°C)280280280Maximum Operating Temperature(°C),10-20 seconds360360360 Thickness available(mm)2-30 2-302-30Thickness tolerance(mm)±0.1±0.1±0.1 Size (mm)1020x1220
1220x2440Thickness (mm)3 to 150


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