Cupric Pyrophosphate
Product NameCupric Pyrophosphate
Molecular StructureOther NameCAS No10102-90-6Molecular FormulaCu2P2O7·4H2OCheck-PointSpecificationExport gradeRefined gradeHigh-purity electroplating best gradeElectroplatin gradeTechnical gradeAppearanceLight green or light blue powder, soluble inMattress Machine acids, insoluble in water, has strong chelating ability to metal ions.Purity %≥ 99.0≥ 99.0≥ 99.0≥ 98.5≥ 98.0Copper content %≥ 34≥ 34≥ 33.7≥ 33.5≥ 33.0Solubility in potassium pyrophosphate %≥ 99.9≥ 99.9≥ 99.9≥ 99. 9--Fe %&lAntenna e;0.01≤0.005≤0.01≤0.01≤0.01Sulphates(SO4)%≤0.005≤0.01≤0.005≤0.01≤0.1Insol. in acids %≤0.05--≤0.05≤0.1≤0.1Heav metal(Pb) %≤0.005≤0.002≤0.003≤0.Inductor 003--Packing:25Kgs woven bag lined with doPrinting Machinery uble-layer plastic bag
Product Usage:Suitable for pyrophosphate copper plating, bronze plating, coppertin alloy plating etc.