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China Ceramic Insulation Plate

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Local Area:	Zhuzhou, Hunan, China
R&D Capacity:	OEM, ODM, Other
Payment Terms:	LC, T/T, PayPal

Brand:	Ry
Application:	Insulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell,
Type:	Insulation Film
Chemistry:	Plate Substrate

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Product Description

Ceramic substrate
1. Alumina ( Al2O3 substrate )
Al2O3 substrate is the most popular ceramic substrate, with excellent heat
resistance, high mechanical strength , abrasion resistance and small dielectric
loss.The surface of alumina substrate is quite smooth and low porosity.99.6%
alumina substrate is suitable for thin film device, 96% alumina substrate is suitable for thick film device application .

2. Aluminium Nitride ( AlN substrate )
Aluminium Nitride has higher thermal conductivity, compared to alumina substrate. It is about 7 to 8 times high. AlN substrate is an excellent electronic package material.

3. Zirconia ( ZrO2 substrate )
Compared to alumina substrate, ZrO2 substrate has higher mechanical strength and fracture toughness it's about three times higher for bending strength, two times for fracture toughness than alumina substrate. ZrO2( zirconia ) also provides good abrasion resistance. It features a thermal expansion rate close to metals.

Ceramic Substrates PropertiesMaterialsAl2O3AlNZrO296%99.60%ColorWhiteWhiteGrayWhiteDensity (g/cm 3 )3.723.853.36.04Thermal conductivity (W/m. K)22.329.5160 -1902.4Thermal Expansion (x10 -6 / o C)88.24.610Dielectric strength1.40E+071.80E+071.40E+07 Dielectric Constant (at 1MHZ)9.59.88.729Loss Tangent (x10 -4 at 1MHZ)3251.00E-03Volume Resistivity (ohm-m)>10 14>10 14>10 14 Flexural Strength (N/mm 2 )350500450