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China Chip Component Barrel Plating Automatic Line pictures & photos

China Chip Component Barrel Plating Automatic Line

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Min. Order / Reference FOB Price
1 Set	US $100.00/ Set

Local Area:	Hefei, Anhui, China
R&D Capacity:	OEM, ODM, Other
Payment Terms:	LC, T/T, PayPal

Type:	Coating Production Line
Coating:	Plating
Substrate:	Ceramic

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Product Description

Application:The mass plating production of chip component and micro metal parts;Pretreatment, silver plating, nickel plating and tin plating of chip components.<o:p>
Project experiences:Electroplating production line for SMD and connectors etc.<o:p>
Feature:The roller is optimal designed of technology according customers requirements.Having reliable system, high efficiency, bright fine and uniform appearance. The line takes man-machine interface touch-screen control management. It can effectively monitor the data, PH, time and running conditions etc,and is easy to adjust process parameter according to different process feature.<o:p>
Technical Specification: Cantilevered crane, the running rate of crane: 0-25 m/min, lifting rate of crane: 0-12 m/min, the lifting weight: 50-100 kg.<o:p>
Option: Special roller, solution online testing and automatic feeding, roller with speed regulator, computer control system, and rectifier automatic control.<o:p>