China Customized Different Thickness Quartz Glass Wafers for Semiconductor Applications

Attribute

Measurements

Diameter

Φ2",Φ3",Φ4",Φ5",Φ6",Φ8",Φ12"

Thickness

0.2mm,0.3mm,0.4mm,0.5mm,0.7mm,1.0mm,1.5mm tolerance±0.02mm)

Dimensional Tolerance

+/- 0.02

Thickness Tolerance

+/- 5μm

Thickness Variation (TTV)

< 0.01mm

Flatness

1/10 Wave/Inch

Surface Roughness (RMS)

<1.5nm

Scratch and Dig

5/2

Particle Size

<5μm

Bow/Warp

<10μm

The following describes the versatility within several of our key processes. For full details on the process, please contact us freely get more information.

Shape Cut
Thin sheets are scribed, thick sheets are water jetted and blocks are wire sawn to begin the process with a wafer "blank".
CNC Edge
Each wafer is individually edged on a Precision CNC Edge Grinding Station.
Lapping
As required, wafers are lapped to precise thickness or flatness.
Polishing
Double-side Commercial Polish removes subsurface damage and Super Polish creates a pristine finish.
Cleaning
We combine ultrasonics and megasonics on multiple cleaning lines which feed directly into a Class 100 Clean Room.
Inspection
In our Class 100 Optical Clean Room, we inspect to various quality levels under the appropriate lighting conditions.
Packaging
All wafers are packed in pre-cleaned containers, double bagged and vacuum sealed within the Class 100