China Diameter 100mmx1.1mmt Optical Glass Round Glass Borofloat33 Pyrex7740

l Glass wafer:
The company introduces advanced laser equipment, ultrasonic instruments, engraving and grinding machines and other advanced equipment, and has experienced technicians who can provide customers with high-precision glass wafers with thickness ≥0.1mm and external dimensions ≥Φ2" Glass wafer), used in CMOS, CCD sensors, integrated circuits or micro-mechanical component packaging (MEMS), communications and data processing, optics, electronics, home appliances, military, scientific research and other high-tech products.

l Product features:
a)Application-specific use of glass material
b)Vast expertise in the area of polishing and unique surface qualities
c)Clean room compatible packaging of ready-to-use substrates
d)Structured wafers with excellent tolerances
e)Customer-specific products that meet all requirements and industry standards (e.g. SEMI)
f)Integrated production processes that meet ISO 9001:2000 requirements and standards

l Typical application:
Micro-optics
MEMS (pressure sensor, accelerometer...)
Wafer level packaging (image sensor package...)
Bioengineering (microfluidics, DNA analysis...)
PLC wafer cover
And many other customer-specific applications.

l Technology parameters:
a) Material :BOROFLOAT® 33,PYREX 7740,Quartz glass,
b) Thickness:0.3mm,0.5mm,0.6mm,0.7mm,1.0mm,1.5mm(Tolerance±0.02mm)
c) Round ize:Φ2",Φ3",Φ4",Φ5",Φ6",Φ8",Φ12"ect..
d) MIL:60/40
e) Roughness(Ra)Less 1.5nm
f) TTV Less 0.01mm
g) Chamfer C0.05~0.2mm
h) Edge collapse Less 0.2mm

Glass wafer plus technical parameter:
a) Material: BOROFLOAT®33, PYREX7740, quartz glass, Corning E-XG, B270, D262T, AF32
b) Standard thickness: 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.7mm, 1.0mm, 1.5mm (thickness tolerance ± 0.02mm)
c) Standard size: Φ2", Φ3", Φ4", Φ5", Φ6", Φ8", Φ12" (other sizes can be customized)
d) Appearance: 60/40
e) Surface roughness (Ra) <1.5nm
f) Parallelism <0.01mm
g) Each edge is blunt C0.05~0.2mm
h) Crack <0.2mm, not crackable
i) The surface is clean and must not be imprinted or stained. It is packaged under a clean workbench and packaged in a special box.

Basic performance of glass wafers:
Technical parameters: density (25 ° C) 2.23g / cm2
Expansion coefficient (ISO 7991) 3.25'10-6k-1
Light transmittance 91%
Softening point 820 ° C
Short-term use <10h 550 °C
Long-term use ≥10h 450°C
Refractive index (587.6nm) 1.47140
Knoop hardness 480