Supplier Homepage Tools & Hardware Abrasive & Grinding Grinding Wheel China Diamond Tools of Metal Bonded Edge Grinding Wheel Semiconductor

China Diamond Tools of Metal Bonded Edge Grinding Wheel Semiconductor

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Min. Order / Reference FOB Price
2 Piece	US $230.50/ Piece

Local Area:	Jian, Jiangxi, China
R&D Capacity:	OEM, ODM, Other
Payment Terms:	LC, T/T

Brand:	Diasc
Material:	Metal Bonded
Abrasive:	Superabrasive
Shapes:	Disc

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Product Description

Details:
metal bond diamond wheels are used for edge grinding of silicon wafers.
Grinding wheel for bevel machining of semiconductor material substrates.
Thanks to a design featuring a uniform layer of fine grains and high-precision finishing technology, this grinding wheel makes high-quality, high-precision machining possible with minimal chipping.
Both outer-circumference machining and notch machining wheels are available in three types: Single-groove, multi-groove, and composite rough finishing.
Features:
Even and ne diamond layer minimizes processing damage. Wear resistant bond with a high grain holding force is used to achieve high shap eretention and a long life. Highly precise slotted shape and nishing technology support various wafer shapes. Copper-less supported.
Spec(mm):
DHTBONDEDGROOVEGRIT SIZED50-250CUSTOMIZED3-20Resin or metal1-10325-800