Product Description99.99% Gold Au Sputtering Plate Gold Target for Thin Film CoatingGold has a density of 19.3 g/cm3, almost identical to that of tungsten at 19.25 g/cm3; as such, tungsten has been used in counterfeiting of gold bars, such as by plating a tungsten bar with gold, or taking an existing gold bar, drilling holes, and replacing the removed gold with tungsten rods. By comparison, the density of lead is 11.34 g/cm3, and that of the densest element, osmium, is 22.588 ± 0.015 g/cm3.
Product Name99.99% Gold Au Sputtering Plate Gold Target for Thin Film CoatingPurity99.99%ColorGold, Lustrous.SputterIntegrated Circuit DCSizeTube/ Plate, CustomizedProcessing MethodPowder metallurgyServiceTarget Bonding withIndium
The sputtering targets we are manufacturing show outstanding performance by virtue of high density, excellent purity, and distinguished homogeneous microstructure.
Our sputtering targets mainly consist of pure metals and alloys, available in both planar and rotatable shapes.
Featured targets from Rhexon:
1.Pure metal:
Ti, Zr, Ta, Nb, Mo, W, Ni, Cr, Al, Zn, Si, Cu,ITO,AZO.TZO,WC,Nb2O5,TiO2, SiO2 withplanarandrotarytype.,2.Typical alloytarget:
1) Ti/Al alloytarget(67:33,50:50at%)
2) W/Tialloytarget(90:10wt%),
Timer & Counter 3) Ni/Valloytarget(93:7,wt%)
4) Ni/Cralloytarget(80:20, 70:30,wt%),
5) Al/Cralloytarget(70:30,50:50at%)
6) Nb/Zralloytarget(97:3,90:10wt%
Transmitter 7) Si/Alalloytarget(90:10,95:5,98:2,70:30,wt%)
8) Zn/Alalloy
9)Pure Cr target(99.95%, 99.995%)
10)Al/Cralloytarget (70:30, 50:50,15:85,67:33,wt%and at%)
11) Ni/CuTool Packaging alloytarget(70:30,80:20,wt%)
12)Al/Ndalloytarget(98:2wt%)
13)Mo/Nb alloytarget(90:10,wt%)
14)TiAlSi alloy target (Ti/Al/Si=30/60/10, 33/67, 40/50/10 ,wt% and at%)
15)CrAlSi alloy target(Cr/Al/Si=30/60/10 ,wt% and at%)and so on, and help set of target material