China Evaporation Metal Pellets Evaporation Material Evaporation Pellet

Product Description99.99% Gold Au SputterTransmitter ing Plate Gold Target for Thin Film CoatingGold has a density of 19.3 g/cm3, almost identical to that of tungsten at 19.25 g/cm3; as such, tungsten has been used in counterfeiting of gold bars, such as by plating a tungsten bar with gold, or taking an existing gold bar, drilling holes, and replacing the removed gold with tungsten rods. By comparison, the density of lead is 11.34 g/cm3, and Instrument Box that of the densest element, osmium, is 22.588 ± 0.015 g/cm3.
Product Name99.99% Gold Au Sputtering Plate Gold Target for Thin Film CoatingPurity99.99%ColorGold, Lustrous.SputterDCSizeTube/ Plate, CustomizedPower Tools Processing MethodBoiler & Furnace Powder metallurgyServiceTarget Bonding withIndium

Evaporation materials high purity titanium pellets 99.995 titanium granules

Item Name

High purity Ti pellets

Purity

99.99% ,99.999%

Available size

Customization is available

Certificates

ISO9001:2008, SGS, the third test report

Impurity content

Low

Application

Widely used in coating processing industries, semiconductor and electronic field ,glass coating and decoration.

Detailed information

Pure titanium and titanium-based alloy are new-style structural materials, mainly used for aerospace industry and marine industry.

Titanium can melt with iron, aluminum, vanadium or molybdenum and other elements, creating high-strength light alloy, which is widely used in all respects, including aerospace ( jet engines, missiles and spacecraft), military, industrial process (chemical and petroleum products, seawater desalination and papermaking), automobiles, agri-food, medicine (prostheses, orthopedic transplant and dental equipment and filler), sporting goods, jewelry and mobile phones and so on.

Quality Standard (99.999% Ti)

Element

Value(<ppm)

Element

Value (<ppm)

Element

Value(<ppm)

Ag

0.05

Al

0.11

As

0.03

Au

0.05

B

0.01

Ba

0.005

Be

0.005

Bi

0.01

Br

0.05

Ca

0.2

Cd

0.05

Ce

0.005

Hg

0.1

Fe

3.2

Ga

0.05

I

0.01

Ge

0.05

Hf

0.01

In

0.05

Ir

0.01

K

0.01

La

0.005

Li

0.01

Pt

0.05

Mg

0.06

Mn

0.06

Mo

0.5

Na

0.01

Nb

0.2

Nd

0.005

Ni

0.24

Os

0.01

P

0.01

Pb

0.01

Pd

0.01

Re

0.01

Rh

0.05

Ru

<0.01

Sb

0.05

Sc

0.05

Se

<0.05

Sm

0.005

Sn

0.05

W

<0.01

Ta

5

V

0.02

Te

<0.05

Th

0.0001

Dy

0.005

Er

<0.005

F

0.05

Zr

0.05

S

0.02

Si

0.24

Cr

0.06

Co

<0.01

Zn

0.05

Cu

0.28

Cl

0.23

Cs

0.01

The sputtering targets we are manufacturing show outstanding performance by virtue of high density, excellent purity, and distinguished homogeneous microstructure.
Our sputtering targets mainly consist of pure metals and alloys, available in both planar and rotatable shapes.
Featured targets from Rhexon:
1.Pure metal:
Ti, Zr, Ta, Nb, Mo, W, Ni, Cr, Al, Zn, Si, Cu,ITO,AZO.TZO,WC,Nb2O5,TiO2, SiO2 withplanarandrotarytype.,2.Typical alloytarget:
1) Ti/Al alloytarget(67:33,50:50at%)
2) W/TialloytarMachinery Stocks get(90:10wt%),
3) Ni/Valloytarget(93:7,wt%)
4) Ni/Cralloytarget(80:20, 70:30,wt%),
5) Al/Cralloytarget(70:30,50:50at%)
6) Nb/Zralloytarget(97:3,90:10wt%
7) Si/Alalloytarget(90:10,95:5,98:2,70:30,wt%)
8) Zn/Alalloy
9)Pure Cr target(99.95%, 99.995%)
10)Al/Cralloytarget (70:30, 50:50,15:85,67:33,wt%and at%)
11) Ni/Cu alloytarget(70:30,80:20,wt%)
12)Al/Ndalloytarget(98:2wt%)
13)Mo/Nb alloytarget(90:10,wt%)
14)TiAlSi alloy target (Ti/Al/Si=30/60/10, 33/67, 40/50/10 ,wt% and at%)
15)CrAlSi alloy target(Cr/Al/Si=30/60/10 ,wt% and at%)and so on, and help set of target material