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China FPC Solder to PCB Hot Bar Bonding Machine

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Min. Order / Reference FOB Price
1 Piece	US $5000.00/ Piece

Local Area:	Shenzhen, Guangdong, China
R&D Capacity:	OEM, ODM, Other
Payment Terms:	LC, T/T, PayPal

Cooling Way:	Air Cooling
Control:	Semi-Automatic
Style:	Vertical

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Product Description

FPC Solder to PCB Hot Bar Bonding Machine
FPC Solder to PCB Hot Bar Bonding Machine Features:
1.Extremely short cycle time with rotary table design
2.Product loading and unloading can be done during the heat sealing process
3.High quality heat seal application up to 0.25mm pitch
4.Pneumatic bonding head provide up to 3,900N force
5.Digital programmable pressure control with LCD display
6.Closed loop PID temperature control with visible LED display
7.Bonding cycle is triggered by a real time pressure sensor
8.Floating Thermode ensure consistent pressure and heat transfer along the flexfoil to LCD and/or PCB
9.Precision product fixtures (2X), easy exchange, provided with micrometer alignment and vacuum to fix components
10.Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch application
11.Full microprocessor logic control.
FPC Solder to PCB Hot Bar Bonding Machine Specification:

ModelFS-S22Size500mm X 750mm X 910mmWork Air Pressure0.5-0.7MPAWorking Area110mm X 150mmTemperature setup0-400ºCTolerance of Temp+2ºCTime of pressing0-99sTolerance of Pressing0.05MPA

Hot Bar Bonding Machine Application: