China Gallium Arsenide Wafer Epiready Wafer Semiconductor Wafer

4 inch single/double sided polished N-Type Si dopant Gallium Arsenide wafer LD/LED applications
www.finewinwafers.comWhat we can supply:GaAs wafers: Monocrystal ingots:2-6inch
orientation:(100)(111)
Type: Ntype Doped silicon, P type, doped Zn, Si undoped
Product description1. Detailed specification:ParameterGuaranteed / Actual ValuesUOMGrowth Method:VGFConduct Type:S-I-NDopant:UndopedDiameter:50.7± 0.1mmOrientation:(100)± 0.50OF location/length:EJ[0-1-1]± 0.50/16±1IF location/length:EJ[ 0-1 1 ]± 0.50/7±1Resistivity:Min: 1.0 E8Max: 2.2 E8Ω·cmMobility:Min: 4500Max: 5482cm2/v.sEPD:Min: 700Max: 800/ cm2Thickness:350± 20µmEdge Rounding:0.25mmRLaser Marking:N/ATTV/TIR:Max: 10µmBOW:Max: 10µmWarp:Max: 10µmParticalCount:<50/wafer(for particle>0.3um)SurfaceFinish- front:PolishedSurface Finish -back:EtchedEpi-Ready:YesParameterGuaranteed / Actual ValuesUOMGrowth Method:VGFConduct Type:S-I-NDopant:UndopedDiameter:76.2± 0.2mmOrientation:(100) 00± 0.50OF location/length:EJ[0-1-1]± 0.50/22±2IF location/length:EJ[ 0-1 1 ]± 0.50/11±2Resistivity:Min: 1E8Max: 1.03E8Ω·cmMobility:Min: 5613Max: 6000cm2/v.sEPD:Min: 700Max: 800Max:Thickness:625±20µmEdge Rounding:Stone Processing Machinery 0.375mmRLaser Marking:N/ATTV:N/AµmSurfaceFinish- front:PolishedSurface Finish -back:EtchedEpi-Ready:Yes
ParameterGuaranteed / Actual ValuesUOMGrowth Method:VGFConduct Type:S-I-NDopant:UndopedDiameter:100.0± 0.2mmOrientation:(100)± 0.30OF location/length:EJ[0-1-1]± 0.50/32.5±1IF location/length:EJ[ 0-1 1 ]± 0.50/18±1Resistivity:Min: 1.5 E8Max: 2.0 E8Ω·cmMobility:Min: 4832Max: 4979cm2/v.sEPD:Min: 600Max: 700/ cm2Thickness:625± 25µmEdge Rounding:0.375mmRTTV/TIR:Max: 3µmBOW:Max: 4µmWarp:Max: 5µmParticalCount:<100/wafer(for particle>0.3um)SurfaceFinish- front:PolishedSurface Finish -back:PolishedEpi-Ready:YesParameterCustomer's RequirementsGuaranteed / Actual ValuesUOMGrowth Method:VGFVGFConduct Type:S-C-PS-C-PDopant:GaAs-ZnGaAs-ZnDiameter:50.8± 0.450.8± 0.4mmWeighing & Measuring Apparatus Orientation:(100)± 0.50(100)± 0.50OF location/length:EJ[0-1-1]± 0.50/16±1EJ[0-1-1]± 0.50/16±1IF location/length:EJ[ 0-1 1 ]± 0.50/7±1EJ[ 0-1 1 ]± 0.50/7±1Ingot CC:Min: 1 E19Max: 5 E19Min: 1.4 E19Max: 1.9 E19/cm3Resistivity:Min: N/AMax: N/AMin: N/AMax: N/AΩ·cmMobility:Min: N/AMax: N/AMin: N/AMax: N/Acm2/v.sEPD:Max: 5000Min: 600Max: 700/ cm2Thickness:350±25350±25µmSurfaceFinish- front:PolishedPolishedSurface Finish -back:EtchedEtchedEpi-Ready:YesYes

Product Pictures:

Package:
Cleaning in class 100 roon, and then 25pcs packed in a cassette. Then we pack all your required wafers in the box well.
FAQ:

Q: What's the way of shipping and cost?

A:(1) We accept DHL, Fedex, TNT, UPS, EMS etc.

(2) If you have your own express account, it's great.If not,we could help you ship themMachinery for Food, Beverage & Cereal .

Q: How to pay?

A: T/T, Paypal, etc

Q: What's your MOQ?

A: (1) For inventory, the MOQ is 5pcs.

(2) For customized products, the MOQ is 10pcs-25pcs.

Q: What's the delivery time?

A: (1) For the standard products

For inventory: the delivery is 5 workdays after you place the order.

For customized products: the delivery is 2 or 3 weeks after you place the order.

(2) For the special-shaped products, the delivery is 4 or 6 workweeks after you place the order.

Q: Do you have standard products?

A: Our standard products in stock.

Q: Can I customize the products based on my need?

A: Yes, we can customize the material, specifications and optical coating for your optical components based on your needs.