China Globalipl CO2 Fractional Laser Scar Removal Machine

Globalipl CO2 Fractional Laser Scar Removal Machine

Applications:
1. Skin renewing and resurfacing
2. Wrinkle removal, skin tightening
3. Acne and acne scar removal
4. Smooth burnt scars and surgery scars, etc
5. Remove intractable chloasmas and pigmentation
6. Sun damage recovery

Advantages:
1. USA Coherent RF laser emitter (optional)
1) even output energy, deeper penetration(8-10mm under the skin)
2) long lifetime:8-10 years
3) smaller sopt size:0.01mm at dia
2. imported excellent 7 articular optical-arm, easy operated and greatly reduces the energy loss;
3. 6 scan modes: sequence, random, maximum distance A&B, Equidistance and fast shot;
4. 7 scan shapes: square, rectangle, round, triangle, oval, 6-diamond shape and line
5. Ultra-quiet pump used, no noise and larger water flow for better cooling, prolong machine life.
6. 2 in 1 system, easy and convenient for operation.
1) Fractional CO2 Laser for skin rejuvenation and scar removal
2) and Normal CO2 laser for surgery operation
7.Particular designed intelligent laser control system ensures a precise treatment
8.Laser energy shooting is an even steady and safe treatment process.
9.Wide range application, effective treatment
10.Easy and fast treatment, no down time.
Features:
1. Particular designed intelligent laser control system ensures a precise treatment
2. Laser energy shooting is an even steady and safe treatment process.
3. Wide range application, effective treatment
4. Easy and fast treatment, no down time.

Basic specificationWavelength10.6μ m, far-infrared laserControlLCD 8.4 inchPulse frequency33.3 HzDuration0.1~10 msDistance0.1~2.6 mmInterval0~6sRepeat1~5000msoverlap1~20 timesAverage power25WWorking mode:Continuous pulse, single pulse, interval pulseScan GraphicsSquare, rectangle, round, triangle, oval, 6-diamond shape, lineDot quantity400 dots at mostWorking stateHyper-pulsed modeScan modeSequence scan, Random scan, maximum distance scanPulse energy10mj to 130mj is optional for each dot.Technical specificationCondenser focusf=50mmBeam divergence angle0.3 mradSpot size0.2 mmAiming beamLess than 2mW, 635nm red semiconductor laserCooling systemClosed loop circulating water + air coolingEnvironment temperature5-40 CRelative humidity< 80%Temperature in transit-40-50 CHumidity in transit< 85%Beam transport deviceArticulated arm with 7-joint and balance weightAtmospheric pressure86.0kpa-106.0kpaWarming up time2 minElectromagnetic requirementNo electromagneticField interferenceN. weight (kg)35kgPower supply220V/110V