Feature:Glue tape lamination machine,automatic punching and cutting hot melt adhesive tape,to carry on the glue on the different models of the chip.Module and tape step by a servo control, electric eye control, convenient adjustment, accurate stepping, glue the unique planar structure, when to replace welding head not in use to adjust the plane.
Model:YMJ-GW11-10K
Technical parameter:
Overall dimension: Approx. L1750 x W500x H1820mm
Weight: Approx. 400kg
Power supply: AC 220V-240V 50/60Hz
Power: Approx.0.8KW
Air pressure: 6 kg /cm2
Air consumption: about 60L/min
Control: PLC
Tolerance of adjustment :±0.03mm
Accuracy:Scale of servo system=0.01mm
Applicable materials: ISO standard cards
Operator: 1 person
Output rate: about 18000-24000pcs/h
Product percent of pass: 99.5 %