Business Type:
Manufacturer/Factory
Business Range:
Diamond Wire Saw, Diamond Wheel
Establishment:
1999
R&D Capacity:
OwnBrand, OEM
Terms of Payment:
LC, T/T
Main Markets:
Southeast Asia, Middle East, Domestic
OEM/ODM Service
Sample Available

Grinding Wheel, Wheel for Silicon, Diamond Grinding Wheel manufacturer / supplier in China, offering Resin Bond Diamond Lapping Wheel (D230 for Silicon), 0.40mm Electroplated Diamond Wire Silicon Sapphire Bricking Core Wire, Electroplating Diamond Wire Saw Tool for Silicon Slicing 0.095mm (80um) and so on.

1
    YRS
General Supplier

China Grinding Hubless Dicing Blade Wheel

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Min. Order / Reference FOB Price
100 Piece US $50.00/ Piece
Local Area: Jian, Jiangxi, China
R&D Capacity: OEM, ODM, Other
Payment Terms: LC, T/T
Brand: Diasc
Material: Diamond
Abrasive: Superabrasive
Shapes: Flat
Product Catergory:
According to the bond type, they can be assorted in three categories: metal bond, resin bond, electroplated bond.
Product Application:
The products are widely used in semiconductor packaging and cutting process. It divides the non-pin products (such as DFN) into independent products, which are convenient for subsequent processes. The product specifivations can be made according to suctomer requirement.