China High Speed Full-Automatic PCBA SMT Solder Paste Printer for Ekra Dek Mpm Gkg Rison

PRODUCT FEATURE
Stable stencil positioning structure
Automatic track width
High precision work table up/down
Stencil&PCB vision correction
Board clamp for warpage PCB
Equipped with wiper system
Vision teaching,compatible for non-standard fiducial
Different level user mode
256 grey scale threshold vision recognition
Floating squeegee print head
Programmable front&rear print pressure individually
Dry/Vacuum/Wet wiping mode

Adjustment jacking platform and Guide Rail positioning System
Stable and easy to adjust, it can quickly adjust the pin jacking height of PCB with different thickness New pattern patented guide rail can detachable, programmable, can automatically stretch out and draw back .
Image and optical system
Using uniform ring light and high brightness coaxial light, with promise brightness adjustment function, then all types of Mark points can be well recognized (Including the rugged Mark points),applicable for tin plating,

Cleaning system
The cleaning system equipped with three cleaning methods: dry cleaning, wet cleaning,vacuum.
It can also be cleaned by manual and automatic cleaning to reduce the cleaning time and improve production efficiency.

Model RX-G10Machine Alignment Capability >2 Cpk @ +/- 12.5μm, 6 Sigma # Process Alignment Capability >2 Cpk @ +/- 25μm, 6 Sigma # Core Cycle Time 7.5 secs Maximum Print Area 510mm (X) x 340mm (Y) Printer Construction One piece optimised welded frameMachine ControlMotion control using Rison Patented network Operating System Windows embedded 7Operator InterfaceColour TFT touch screen display, keyboard and mouse with Rison software. Machine mountable on either left or right hand side.CameraDigital camera, using IEEE 1394 interface. Multi channel. LED lighting. FOV 8mm x 6mm. Inspection window 48mm2Camera PositioningRotary motors and encoders with 4 micron resolutionSqueegee Pressure MechanismSoftware controlled, motorisedStencil Positioning Pneumatic cylinder clampingWork Table Alignment Motorised via actuators X, Y, and Theta X,Y : 7.5 mm θ±2ºBoard Support Magnetic Support Pin Capable to handle fixture SqueegeeFloating double squeegee (1 set included,option:Trailing edge) Stainless Steel Squeegee Blade (Inclination 60º/45º/30º Rubber SqueegeeMachine Interface Upline and downline SMEMA included ConnectivityRJ-45LAN (networking) and USB2 interface available Tri Colour BeaconProgrammable with audible alarm documentation Hard copy manuals comprising: Operator, Installation, Electrical Drawings.Transport System Specification TypeSingle piece with 3mm Flat transport belts, front rail fixed ESD CompatibilityBlack transport belts and guides with surface resistivity of greater than 106 ohmsWidth Adjustment Programmable motorized rear rail Transport Direction Left to right ,Right to left ,Left to left ,Right to right Substrate Handling Size (minimum) 50mm (X) x 50mm (Y) Substrate Handling Size (maximum)400mm (X) x 300mm (Y) Substrate Thickness 0.2mm to 6mm Substrate Weight (maximum) 1kg Substrate Warpage Up to 1% of PCB DiagonalSubstrate FixtureOver the top clamps Side SnuggersVacuum Hold (Option) Substrate Underside Clearance Programmable 3mm to 40mmProcess Parameters SpecificationPrint Pressure 0kg to 10kg Print Speed 6mm/sec to 200mm/sec Print Gap0mm to 6mm Substrate SeparationSpeed: 0.1mm/sec to 2mm/sec Distance: 0mm to 2mm Print Modes Print / Print Print / Flood Flood / PrintPaste Knead Programmable: number; period; on demandVision Specification Fiducial Recognition Automatic fiducial teach and find incorporating 0.1mm fiducial capture Fiducials2 or 3Fiducial TypesSynthetic fiducial library or unique pattern recognition Fiducial Size 0.1mm to 3mm Fiducial Locations Anywhere on substrateFiducial Error Recovery Auto lighting adjustment Auto fiducial search Camera LightingSoftware controlled programmable LED lightingChase Specification Screen frame Size (maximum)736mm x 736mm (29" x 29") Screen frame Size (minimum)370mm x 470mmScreen frame Thickness 25mm to 38mm (1" to 1.5") Image Position Front Centre Custom Stencil Wipe Specification Operation Mode Programmable Wet/Vacuum/DrySolvent PumpAutoVacuum Zic-Zac Feature Option:Left & Right Zic-ZacOperating Environment Specification Temperature 10° to 35° C (50° to 95° F) Humidity 30% to 70% relative humidity (non-condensing) 30% to 70% Services Specification Voltage AC 220 Volts +/- 10%. Single phase 50/60Hz,3Kw Maximum Current at 220V 10 Amps with vacuum pump 3 Amps without vacuum pumpOver Current Protection An external circuit breaker ≤ 25 Amps is required to be fitted in line with the machine supply Air Supply To ISO 8573.1 Standard Quality Class 2.3.3 Pressure 5 bar to 7 bar General usage 5 litres/minute at 5 bar to 7 bar Process Height 890mm ±30mmMachine Dimension 1360 x 1180 x 1371 mm (Excluding Monitor & Light Tower)Machine Weight Approx 1000 Kg