Business Type:
Manufacturer/Factory
Business Range:
BGA Rework Station, Reflow Oven, Wave Soldering Machine, IR-Preheating Plate, Infrared IC ..
Establishment:
2007
R&D Capacity:
OwnBrand
OEM/ODM Service
Sample Available

Desktop Reflow Oven, Reflow Oven, PCB Soldering Machine manufacturer / supplier in China, offering Puhui Desktop Reflow Oven T937, LED SMT Reflow Oven T-937m, T-8280 IR Preheating Plate, BGA Repair Tool, Welding Machine, BGA Machine, SMD Rework Station, Taian Puhui, Puhui Factory Original SMT T-961 Benchtop LED New Light Source Reflow Oven for Leadfree Soldering and so on.

1
    YRS
General Supplier
Supplier Homepage Industrial Equipment & Components Welding Equipment Welding Auxiliary Equipment & Apparatus China Infrared BGA Balling Station BGA Rework Station Motherboard BGA Chips Repair Machine T-862

China Infrared BGA Balling Station BGA Rework Station Motherboard BGA Chips Repair Machine T-862

Get Latest Price
Min. Order / Reference FOB Price
1 Piece US $220.00/ Piece
Local Area: Taian, Shandong, China
R&D Capacity: OEM, ODM, Other
Payment Terms: LC, T/T, PayPal
Color: Black
Specification: 220v/110v AC 50-60Hz
Trademark: Puhui
Infrared bga Balling Station, bga Rework Station, Motherboard bga chips Repair Machine T-862


Technical parameters 862
Power: 600W
Voltage: AC110V-220V 50/60HZ
Infrared lamp body power: 100W
Preheating plate power: 350W
Working bench size: 350*260mm
Infrared lamp body heating size: 25*25mm
Preheating plate size: 120*80mm
Preheating plate temperature range: 450
Infrared lamp body temperature range: 100-350
1. Infrared welding technology which was developed independently.
2. Infrared heating is easy to pierce and distribute evenly, can avoid the IC damage due to the fast or uninterrupted heating up.
3. Easy operate; User can operate skillfully after one-day training.
4. No need welding tools, it can weld any chips under 25mm (T-862).
With hot melt system, preheating range 120*80mm (T-862).
5. It doesn't impact the smart parts without hot air, and suits to weld all kinds of chips, especially Micro BGA components.