Ucreate LTD PCB's aim
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1.Products Application2. Market Distribution
3.Technical CapabilitiesItemsSpeci.RemarkMax panel size32" x 20.5"(800mm x 520mm)Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm)Min PAD (inner layer)5 mil(0.13mm)hole ring widthMin thickness(inner layer)4 mil(0.1mm)withouTest Instrument t copperInner copper thickness1~4 ozOuter copper thickness0.5~6 ozFinished board thickness0.4-3.2 mm
Board thickness tolerance control±0.10 mm±0.10 mm1~4 L±10%±10%6~8 L±10%±10%≥10 LInner layer treatmentbrown oxidationLayer count Capability1-30 LAYERalignment between ML±2milMin drilling0.15 mmMin finished hole0.1 mmHole precision±2 mil(±50 um)tolerance for Slot±3 mil(±75 um)tolerance for PTH±3 mil(±75um)tolerance for NPTHCleaning Swab ±2mil(±50um)Max Aspect Ratio for PTH8:1Hole wall copper thickness15-50umAlignment of outer layers4mil/4milMin trace width/space for outer layer4mil/4milTolerance of Etching+/-10%Thickness of solder maskon trace0.4-1.2mil(10-30um)Printing Machinery at trace corner≥0.2mil(5um)On base material≤+1.2mil
Finished thicknessHardness of solder mask6HAlignment of solder mask film±2mil(+/-50um)Min width of solder mask bridge4mil(100um)Max hole with solder plug0.5mmSurface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, ImmersiMeter for Liquid & Gas on Silver.Max Nickel thickness for Gold finger280u"(7um)Max gold thickness for Gold finger30u"(0.75um)Nickel thickness in Immersion Gold120u"/240u"(3um/6um)Gold thickness in Immersion Gold2u"/6u"(0.0Ventilation Equipment 5um/0.15um)Impedance control and its tolerance50±10%,75±10%,100±10% 110±10%Trace Anti-stripped strength≥61B/in(≥107g/mm)bow and twist
0.75%
4.Products Equipment