LED Related WCu Alloy Copper Tungsten Heat Sink
Tungsten Copper high performance composites are fabricated from carefully controlled porous tungsten that is vacuum infiltrated with molten copper. This results in a W/Cu composite that has high conductivity and a matched low thermal expansion for heat sinks. It is a composite of tungsten and copper. By controlling the content of tungsten, we can design its coefficient of thermal expansion (CTE), matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Kovar, etc.
Advantages
High thermal conductivity
Excellent hermeticity
Excellent flatness, surface finish, and size control
Semi-finished or finished (Ni/Au plated) products available
Heat sinks are used to conduct heat away from computer chips and integrated circuits, preventing thermal damage. Depending on the electronic device, heat sinks come in different sizes and shapes. Tungsten-copper composites, with copper content (by weight) of 15 to 20 percent, are often used to make heat sinks. Our products are widely used in applications such as optoelectronics packages, Microwave Packages, C Packages, Laser Submounts, etc.
Specifications of WCu Alloys:
Material
W90Cu10
W88Cu12
W85Cu15
W80Cu20
W75Cu25
Tungsten Content (wt%)
90 ± 1
88 ± 1
85 ± 1
80 ± 1
75 ± 1
Density at 20°C (g/cm3)
17.0
16.8
16.3
15.6
14.9
Coefficient of thermal expansion at 20°C (10-6/K)
6.5
6.7
7.0
8.3
9.0
Materials
(article name)
Composition
[wt%]
Density at 20°C
[g/cm2]
Coefficient of
thermal expansion at20°C
[10-6/K]
Thermal conductivity
at 20 °C
[W/(m·K)]
Molybdenum
Mo 99.97%
10.2
22°C5.5/800°C5.7
xyz142
Tungsten
W 99.95%
19.3
22°C4.5/800°C4.8
xyz165
MoCu
Mo-30% Cu
9.7
22°C7.1/800°C7.8
xyz205
WCu
W-10% Cu
17.1
22°C6.4
xyz195
WCu
W-15% Cu
16.4
22°C7.3
xyz215
WCu
W-20% Cu
15.5
22°C8.3
xyz235
Cu/Mo-30Cu/Cu
(PMC)
1:4:1 /
Mo-52%Cu
9.4
200°C9.0/800°C7.3
xy280/z170
Cu/Mo/Cu
(CMC)
1:1:1 /
Mo-66%Cu
9.3
22°C8.3/800°C6.4
xy305/z250
Cu/Mo/Cu/.../Cu
(S-CMC)
5:1:5:1:5 /
Mo-87%Cu
9.2
200°C12.8/800°C6.1
xy350/z295
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