China Lead Free Infrared IC Heater Mini Reflow Oven T-962 Solder Reflow Oven

Lead free Infrared Reflow oven T-962, solder oven
Micro-processor controlled reflow oven, suit for various soldering of SMD/BGA automatically,
easy operate; Fast infrared and hot air heating, make temperature more accurate and evenness.
Fuzzy temperature control technology, visualization drawer, can see the whole soldering process
very clearly. It can achieve soldering of single and double-sides PCB board.
FEATURES
(1) A large infrared soldering area
Soldering area: 180*235mm (T-962);
this increases the usage range of this machine drastically and makes it an economical investment.
(2) Choice of different soldering waves
Parameters of eight soldering waves are predefined and the entire soldering process can completed
automatically from Preheat, Soak and Reflow through to cool down.
(3) Special heat up and temperature equalization with all designs
Big power of energy efficient Infrared heating and air circulation to re-flow solder.
(4) Ergonomic design, practical and easily operated
Good build quality but at the same time light weight and a small footprint allows the T962 to be easily
bench positioned transported or stored.
(5) Large number of available functions
Solder most single or double-sides PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc.
It is the ideal rework solution from single runs to on-demand small batch production.