Business Type:
Manufacturer/Factory,Trading Company
Establishment:
2002
R&D Capacity:
OEM, ODM, Others
Terms of Payment:
LC, T/T, D/P, Paypal, Western Union
Main Markets:
North America, Europe
OEM/ODM Service
Sample Available

1
    YRS
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Supplier Homepage Electronic Components SuppliesElectronic Accessories SuppliesInsulation Materials Elements China Lesifu paper phenolic pcb bakelite phenol resin 4x8 phenolic laminate bakelite sheets

China Lesifu paper phenolic pcb bakelite phenol resin 4x8 phenolic laminate bakelite sheets

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Min. Order / Reference FOB Price
10 Pieces US $50.00/ Pieces
Local Area: Yichang, Hubei, China
R&D Capacity: OEM, ODM, Other
Payment Terms: LC, T/T, D/P, Paypal, Western Union
Brand: Lesifu
Place of Origin: Hubei, China
Brand Name: Lesifu
Model Number: bakelite sheet
SpecificationCommodityLesifu paper phenolic pcb bakelite phenol resin 4x8 phenolic laminate bakelite sheetsThickness0.5mm, 1.5mm, 2mm , other thickness is from 1.5mm to 20mmSizecommon size is 43"*49", other size according to your requestMaterialphenolic glue and kraft paperWhat is phenolic resin back up boardphenolic resin back up board-base sheet is made of insulating impregnated paper soaked in hot pressed phenolic resin. High mechanical and electrical properties.Packagingby wood palletUsagesports locker, cafes, laboratory, school, hospital, public places, office, kitchen cabinets, wardrobeBrand NameLesifuCertificationGB/T 19001-2016/ ISO 9001:2015GB/T 24001-2016/ISO 14001:2015Sea portYichang or ShanghaiProduct DescriptionAdvantage of our phenolic resin backup board:Good heat dissipation and stability , no warping and distortion, avoid violent vibration, prevent the drill needle offset caused by excessive hole diameter and hole position tolerance, so effectively avoid scratching on the surface of PCB, reduce by burr. Low moisture content, long warranty period, stable & reliable quality.Lesifu Phenolic Resin Back Up BoardUsageSuitable for fine multilayer PCB/ FPC use.Introductiona) the multi-layer structure, high-grade paper laminated together with a phenolic resin glue;
b) high-precision, non-hierarchical or off;
c) reduce the burr when drilling;
d)surface formation, avoid warpage due to climate change;Storagea) a relative humidity of 80% or less, at less 28℃ temperature;
b) stretch the whole cover, is not directly exposed to the air, to cut off contact with moisture and the board;
c) the height of each pallet should be no more than 3 levels;
d) when in wet weather, if open stretch film, try to use it up within 24 hours, in order to prevent deformation of the absorbent sheet.Recommend Products

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