China Manufacturer Thermal Silicone Pad for CPU Heat Sink PCB

PM300 thermal pad combine high thermal conductivity with compliance perfect, can fill the gaps, improve heating parts and the radiating part of the heat transfer capacity. These soft interface material can make the minimum pressure and the surface to combine , resulting in little or no stress on mating parts. Taking advantage of silicone soft and elastic characteristics, placed between the power heating device and heat dissipating structure, the power module effectively transfer the heat to the radiating component.
Applications:
1.Car engine module, notebook computer
2.Flat panel TV, mobile equipment, high-speed hard disk drive
3.Between semiconductor and radiating fin
4.Desktop, portable computer and server
5.LED lighting device, the power supply of UPS
6.LED and PDP flat panel display
Performance:
High thermal conductivity:3.2W/m-k
Stable Performance, low thermal resistance, effectively improve the heat transfer speed
Low hardness, its viscosity high, easy to use
Specification:
Standard size:310mm*310mm, 200mm*400mm according to customer needs cut the shape
Basic thickness:0.25mm*5.0mm, special size and thickness can be customized
Its slightly viscous, if need to strengthen the adhesive can be according to customer's requirement
Product color is mass production color, need special color can be adjusted according to the actual situation