1.Intermittent hot air is introduced to incrSwitch ease the breaking rate of materials,Prevent material overflow from tray and waSemiconductor ste material.2.The hot air is added to increase the supply of heat energy,Increase the drying efficiency.Layered, split-range supply of drying carts for each floor,IncreaCar Safety sed dry area by hot air flow to increase efficiency.3.Process control Segmented treatment, use high vacuum when material moisture is high,Increase drying efficiency;When the moisture content of the material is low,will start low vacCasting & Forging uum and to ensure the controllability of the material drying ratio.4.The machine adopts advanced optimization design to make the whole machine dry area Increased to 2Sound Module 3.2m2.
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