China Milling Embedding Device

Integrating with glue layer taping, conducting resin releasing, bonding, module punching, implanting and pre-personalization.

Module stepping controlled by servo system to keep the pulling distance be adjusted by parameter directly. The exact photoelectric sensor monitoring makes the module in double protection and be recognized automatically.

The accurate of IC pick can reach to +/-0.01mm by intelligent composition unit. Moving position can be set directly.

The special digital video recorder can know about the accuracy of glue releasing easily.

Special in-feeder & out-feeder magazine auto-transfer system is easier to operation.

Film is released by special plane construction and several heading head to solve the problem of high temperature glue. No need to adjust the plane when the bonding heads are changed.

Hot welding avoids the glue failure by special plane constructure. Several groups of hot welding and cold welding head can keep the quality of implanting.

Cards transferred through servo motor to ensure the safety and stability of the machine.

IC implanting height detection can make sure the quality rate.

Special feeding design avoids unloading double cards caused by static electricity.

High capacity magazine for 2000pcs cards/ time.

Personalized system can be compiled for the designed program.

Tech.Specification

Dimension: H2100*W1500*L3200mm

Weight: about 2000kg

Electric: AC220V 50/60HZ 20A

Power: 7.0KW

Compress Air: 6 kg/cm2

Air Consumption: 250L/min

Control Method: single axis located + PLC control

Servo Precision: X, Y=0.0125mm

Tolerance: 0.01mm

Operator: 1 person

Output: 5000pcs/h