China Optowave Laser Head FPC Separator Laser PCB Depanelling Machine

Optowave Laser Head FPC Separator Laser PCB Depanelling Machine

Laser PCB Depanelling Machine Feature:1. Neat and smooth edge, no burr or overflow2. More quick and easy, shorten the delivery time;3. High quality ,no distortion,surface clean& uniformity;4. Gathering the CNC tech,laser tech,software tech…High accuracy,High speed5.High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.6.Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;7.Reduce energy consumption, Cost savings.8.Cost-effective, fast cutting speed, stable performance

Laser PCB Depanelling Machine Specification
Max. working area (X x Y x Z)
400 mm x 400 mm x 12 mm
Max. recognition area (X x Y)
400 mm x 400 mm
Max. material size (X x Y)
390 mm x 390 mm
Data input formats
Gerber, X-Gerber, DXF, HPGL,
Max. structuring speed
Depends on application
Positioning accuracy
± 25 μm (1 Mil)
Diameter of focused laser beam
20 μm (0.8 Mil)
Laser wavelength
355 nm
System dimensions (W x H x D)
1000mm*940mm*1520 mm
Weight
~ 450 kg (990 lbs)

Power supply
230 VAC, 50-60 Hz, 3 kVA
Cooling
Air-cooled (internal water-air cooling)
Ambient temperature
22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)
Humidity
< 60 % (non-condensing)
Required accessoires
Exhaust unit
PCB Laser Depaneling Machine Working Principle:
humidity sensor ( humidity and temperature signal ) → Microcomputer ( CPU Central Processing Unit ) → Heaters ( PTC heating module polymer material heating ) → Smart shape memory alloy ( alloy shape with temperature change ) → Balance spring ( general balance spring with alloy)