China Precision Dicing Saw for Wafer Cutting of Φ 6′′ Inch

DS613 precision dicing machine uses DS-200 software control system, touch screen control and GUI interface so that the image alignment of workpiece is simple and convenient. DS613 has stable performance and low failure rate. DS613 is applicable to the cutting process of silicon, PCB, EMC, ceramic, glass, lithium niobate, quartz, sapphire, GaAs and crystal.
FeaturesSelf-check and alarm function of height measurement system Database management of workpiece and cutting blade Two-way blade lifting for cutting Graphic alignment functionReal-time display and early warning of blade edge exposure

Specifications
Configuration and performanceWorkpiece sizeΦ6'' | ≤160mm x 160mmGroove depth≤4mm or customizeTable flatness±0.005mm/100mmAlignment system70x straight light + ring light(210x optional) SpindleRevolution speed range3000~40000 rpm Output power1.25kW X axisDrive modeServo motorMax. stroke240mmStroke resolution0.001mm Feed speed range0.1~400mm/sY axis Drive modeStep motor + grating closed-loop control systemMax. stroke170mmStroke resolution0.0005mm Single-step positioning accuracy≤0.003mm/5mmIndex positioning accuracy ≤0.005mm/170mmZ axisDrive modeStep motorMax. stroke30mm Stroke resolution0.001mm Repeatability accuracy0.002mm Θ axis Drive modeServo motorMax. rotating angle360°Angle resolution0.0005° Basic specificationPower supplySingle phase, AC220V±10%Power consumption0.8kW (processing)0.7kW (warming up)Compressed airPressure: 0.55~0.8Mpa; average flow rate: 350L/minCleaning water Pressure: 0.2~0.4Mpa; flow rate: 3.0L/minCooling waterPressure: 0.2~0.4Mpa; flow rate: 1.5L/min Exhaust air rate2m3/min (ANR)Overall dimensions WxDxH665mmx850mmx1650 mmWeight 500kg

Environmental Conditions

• Use clean, oil-free air (dew point below -15, residual oil: 0.1 ppm, and filtration rating: 0.01μm/99.5 % or more).
• Keep room temperature fluctuations within ±1ºC of the set value (Set value should be between 20ºC - 25ºC), indoor humidity no more than 80% and no condensation.
• Keep cutting water and cleaning water 2ºC above room temperature (fluctuations within ±1ºC). Keep temperature of cooling water the same as room temperature.
• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.
• This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.
• Please follow the product manual of our company.