Business Type:
Trading Company
Business Range:
Antenna, 5G Antenna, Satcom Antenna, RF Component, Satellite Antenna, Mobile Antenna, 5G
Establishment:
2012
R&D Capacity:
ODM, OEM, Other
OEM/ODM Service
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Digital TV Antenna, Satellite Antenna, Ka Band manufacturer / supplier in China, offering Ga280-Ku Band GPS Aviation Communication Satellites Dish Antenna, 15km Laser Range Finder Photoelectric Military Rangefinder, T600-0.6m Ku Band Outdoor Mobile Satcom Satellites Antenna and so on.

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Supplier Homepage Electrical & Electronics Circuit Board Rigid PCB China Radio Frequency High Frequancy RF Ceramic PCB Rorgers Arlon Shengyi

China Radio Frequency High Frequancy RF Ceramic PCB Rorgers Arlon Shengyi

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Local Area: Beijing, China
R&D Capacity: OEM, ODM, Other
Payment Terms: LC, T/T, PayPal
Brand: Aeitek

Ceramic RF PCB

With the development of science and technology, printed circuit board has become an indispensable electronic component. At present, printed circuit board has been renamed as electronic substrate. traditional inorganic substrates are based on Al2O3,SiC,BeO and AlN. these materials have good properties in thermal conductivity, flexural strength and thermal expansion coefficient. they are now widely used in the MCM circuit substrate industry. The circuit substrate materials studied in this study were prepared by sintering silicon-carbon bar resistance furnace with Al2O3 and AIN as the main raw materials, and then their relative density, dielectric constant and dielectric loss properties were investigated.

Relative density will affect the hardness of ceramic substrate, fragile problem has always been a big problem in the heart of RFID manufacturers, high density, will not be so easily broken. dielectric constant and dielectric loss will directly affect the signal transmission of RFID electronic labels.

Relative density analysis

we put a AIN ceramic substrate and a Al2O3 ceramic substrate at the same temperature. with the increase of temperature, the relative density of its substrate material increases with the increase, and the temperature reaches 1100ºC to the maximum. When the addition amount of Al2O3 ceramic substrate is 60 wt%,AIN the addition amount of ceramic substrate is 10 wt%, the relative density of aluminum nitride ceramic substrate integrated circuit substrate material is the largest relative to other formulations, and the sample is denser at this time, which is beneficial to AIN the improvement of mechanical properties of ceramic integrated circuit substrate material.

Dielectric constant analysis

from the above experiments, it can be seen that the dielectric constant increases with the increase of temperature. dielectric constant reaches the maximum when the temperature reaches 1100ºC. when the Al2O3 ceramic substrate addition amount changes from 50 wt% to 65 ceramic substrate addition amount changes from 20 wt% to 5 wt%, the dielectric constant of alumina integrated circuit substrate material shows the trend of first increasing and then decreasing. when the alumina ceramic substrate content is 60 wt%,AIN the ceramic substrate content is 10 wt%, the prepared sample has the best performance. this is because the factors affecting the dielectric constant are manifold, as long as the chemical composition in the formulation composition is involved, the greater the dielectric constant is when the content of alkali metal ion oxide is more. in addition, the thermal movement of each ion and dipole during the process of increasing temperature increases with strengthening, which eventually leads to the increase of dielectric constant.

Dielectric loss analysis

as the temperature increases, the dielectric loss gradually decreases. While Al2O3 ceramic substrate 50wt% to 65wt%, AIN ceramic substrate 20wt% to 5wt%, the dielectric constant will fistly down and then up. Wile Al2O3 ceramic substrate additive as 60wt%,AIN additives as 10wt% with sintering temp.1100ºC, the diaelectric constant of sinterred samples is minimum.

the experiment can be seen that the Al2O3 ceramic substrate is more suitable for use on RFID electronic labels than the AIN ceramic substrate.

Domestic research on the RFID has been very mature, domestic ceramic circuit board enterprises are not many, at present can successfully mass production is even rare, Slitton, as the ceramic circuit board industry leader, it is necessary to lead the entire industry progress, to help RFID further.

PCB Factory


Process Capability

Max.A/R 10:1 Max. 6OZ
Max. working panel size 2000x610mm
Thinest 4L 0.33mm, Min. mechanical drill/ solering pad 0.2/0.4mm.
Min.drill tolerance +/-0.05mm PTH size tolerance +/-0.05mm
Min. trace width/space 3mil/0.075mm
Well experience in the hybric lamination of :
FR4+ROGERS,FR4+PTFE,FR4+408HR,ceramics+FR4
Custom services are available, please send us the gerber files or your design requirement.
Thank you very much.