China Reflow Oven Mini-Type Lead Free Reflow Oven

Desk Reflow Oven Features:
Cost-effective Desk Reflow Oven utilizes forced air convection heating technology and PC software interface to make an accurate temperature profile quickly and easily. T200C+ is a fine temperature profile model with temp testing capable of lead-free soldering.
PC interface software control and visional operation
Heating mode: Infrared ray + Hot air convection
Effective working table area: 360mm *230mm
Real-time temperature testing function fills the blank of SMT industry overall world for adjusting the temperature at the real time.
Patented heater installation® For heating evenly
Patented forced air cycling and ventilating technology® For extremely uniform temperature profiling across the board.
Patented oven door actuating device® For no vibration after PCB welding.
It satisfies all welding requirements of 0201 resistance and capacitance, fine pitch QFP, SOP, PLCC, BGA, CSP and so on. It meets the requirements of small batch and multimode production. It is also suitable for laboratory and research institute.

Temperature control segment40 segment,
The segment can be set in computer according to the actual requirement.Temperature-zone numbersSingle-zone and multi-segmentTemperature control systemPC control system ,SSR non-contact outputTemperature accuracy± 2 ºCWarm-up time3minTemperature rangeRoom-temperature -360ºCHeating supplyInfrared ray + Hot air convectionEffective working table area360mm * 230mm (more than A4)Welding time3min ± 1minTemperature curveIt can be set ,adjusted and tested according to the actual requirement .Cooling systemTransverse flow equal coolingRated voltageAC single-phase, 220V; 50HzRated power3.8KWMean power1.6kwWeight35 kgDimension(L * W * H) 610*510 *310mm