Copper, Iron, Zirconium manufacturer / supplier in China, offering Titanium Sputtering Target, Cumnni Sputtering Target, 3n5 Eb Melting Thin Film Coating Material Hafnium Target and so on.
Min. Order / Reference FOB Price | |
---|---|
1 Piece | US $150.00/ Piece |
Local Area: | Changsha, Hunan, China |
---|---|
R&D Capacity: | OEM, ODM, Other |
Payment Terms: | LC, T/T, PayPal, WesternUnion |
Shape: | Rotary |
---|---|
Certification: | ISO |
Product Name: | Si Sputtering Target |
Since 2014
Specializing in high purity sputtering targInstruments & Meters ets.
Leader manufacturer of sputtering materials in China.
Qualified the world certificates such as ISO9001:2008 and SGS.
Comprehensive in R&D, manufacturing, and sales on thin film materials.
Export to more than 15 countries in Europe, Southeast Asia, South America and areas, etc.
OUR ADVANTAGE1,Many years manufacturing & exporting experience.2 Strict & complete QC systerm3,Perfect after sale systermChemical Composition: pure gold
Available Purity: 4N-5N
Production Technology: EB melting
Shapes: planar targets, rotary targets
Average Grain Size: <100um
Silver is aMachinery for Packaging Supplies kind of precious materials.
Gold sputtering targets is a very important materials of semiconductor, it's used for depositing gold thin film on the surface of semiconductor chips, to form ohmiccontact film, electrode or other films, it can form various metallic films system. Most of gold oxide film system can be used for manufacturing LED, microwave communication device, widely applied in spaceflight,aviation, semiconductor chips and Solar Cells.
COMPANYPROFILE:
Since 2014
Specializing in high purity sputtering targets.
LeadeEnergy Saver r manufacturer of sputtering materials in China.
Welding & Soldering Ventilation Equipment Supplies Qualified the world certificates such as ISO9001:2008 and SGS.
Comprehensive in R&D, manufacturing, and sales on thin film materials.
Export to more than 15 countries in Europe, Southeast Asia, South America and areas, etc.
OUR PRODUCTS *metal Target : W, Mo, Ta, Nb, Cu, V, Ni, Ti, Fe, Al ,Zr, Co, Au, Ag, Pt, etc.*Alloy Target :NiFe,NiCr,NiV,CuNi,TiAl,CoCr,CoFe, WTi, CoTaZr,CuInGa, ZnSn,CuZn, etc*CeramicTarget : TiO2,Al2O3,Ta2O5, ZrO2,SiC,SiO,SiO2, ITO, GZO, AZO, WS2,MoS2,Ga2O3,HfO2,etc*EvaporationMaterials : Crucible,Pellets,Granules,Pieces,etc*Backing Plate: Cu, Mo, SS,etc*Bonding Service: Indium, Elastomer