China Silicon Wafer High Precision Grinding Polishing Machine

Description
Major in pricise lapping ceramic chip, sapphire pieces, silicon slice etc hard material.
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KD24QXL4 PRECISION GRINDING AND POLISHING MACHINE
Usage: Major in pricise lapping ceramic chip, sapphire pieces, silicon slice etc hard material

Features:
1.The servo fix plate system, to ensure sufficient flatness of mill;
2.Mill on-line monitoring temperature system to prevent distortion and take off flick;
3.Multiple segments or flexible pressurize system, can satisfy the demands of complex processing technology;
4.KIZI original high wear-resisting cast copper mill, greatly improve the efficiency and reduce the cost;
5.Digital charging system, reducing the grinding fluid loss;
6.Rapid positioning device, improve the production efficiency;
7.Four location independent variable speed control system.
Our Service
1. Factory with competative price,high quality and stability
2. R&D Dep. with 20 technicians, 5 of them in decades experience
3. Free charge of customer sample making
4. Completed After sales service and expertise support from Taiwan
Our Company
Workshop & Lab
Company Activity
Patent
Packing & Delivery
Packing Details : Packing, 1 pcs/carton
Delivery Details : Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer.
Q: How long is your delivery time?
A: Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
A:No, we could not offer the machine sample for free charge but can provide free proofing for the customer.