China Single Component Silicone Encapsulant Adhesive for LED Circuit Board

JRF-BM800 Single-component silicone adhesive sealant, has excellent resistance to cold-thermal changes, anti-stress properties, high low temperature resistance, at -60 ~ 200 ºCkeep long-term elasticity and stability, anti-UV, anti-aging, and has excellent insulation, moisture resistance, shock resistance ,corona resistance, anti-leakage and chemical resistance properties. in line with the EU ROHS directive.

Application :

- high frequency head, set-top boxes bonding fixed

- moisture-proof and waterproof encapsulation of sophisticated electronic components

- LED Display module and pixel waterproof encapsulation

- suitable for small or thin layer thickness (potting generally less than 6 mm) electronic components, modules, optoelectronic display and potting protection of circuit board.

How to use :

1.cleaning : clean up the surface of an object will be potting, remove rust, dirt and grease, etc.

2.sizing : unscrew the hose cap , squeeze glue on the clean surface, make it a natural leveling.

3.curing : sealing parts be placed in the air, after the epidermis formation, and then from the surface to the internal curing process, within 24 hours (at room temperature and 55% relative humidity), silicone sealant will solidify 2 ~ 4mm depth, the curing depth increases gradually with the extension of time , due to deep curing , need for a long time, so suggest single component silicone sealant generally used for small electronic components and a thin layer potting, 6 mm thick sealant fully cured need more than 7 days .

Note: it is recommended that the thickness is thicker than 6 mm potting choose double component types .

Before and after curing technology parameter table

Model No.

JRF-BM800

JRF-BM800

JRF-BM800

Before Curing

Appearance

Transparency

White

Black

Viscosity(cps)

5000~30000

5000~30000

5000~30000

Relative Density(g/cm3)

1.00~1.05

1.1~1.2

1.1~1.2

Surface Dry Time(min)

1.5-5

3-15

3-15

Completely Cure Time (d)

3~7

3~7

3~7

Curing Type

Neutral

Neutral

Neutral

After Curing

Hardness (Shore A)

25±5

25±5

25±5

Tensile Strength(MPa)

≥0.6

≥0.6

≥0.6

Shear Strength(MPa)

≥0.5

≥0.5

≥0.5

Elongation(%)

100~200

100~200

100~200

Use Temperature (ºC)

-60~200

-60~200

-60~200

Volume Resistivity (Ω·cm)

≥5.0x1016

≥5.0x1016

≥5.0x1016

Dielectric Strength (kV/·mm)

≥20

≥20

≥20

Dielectric Constant (1.2MHz)

2.8

2.8

2.8

Loss factor (1.2MHz)

0.001

0.001

0.001

The above performance data were at 25 ºC, relative humidity of 55% measured 7 days after curing. Our company does not undertake relevant responsibilities for test conditions different or product improvement of data different .

Specification :

100 ml /pc , 100pc / carton