China Super Thin Borosilicate Glass Wafer for CMOS Imaging Sensor

The company introduces advanced laser equipment, ultrasonic instruments, engraving and grinding machines and other advanced equipment, and has experienced technicians who can provide customers with high-precision glass wafers with thickness ≥0.1mm and external dimensions ≥Φ2" Glass wafer), used in CMOS, CCD sensors, integrated circuits or micro-mechanical component packaging (MEMS), communications and data processing, optics, electronics, home appliances, military, scientific research and other high-tech products.

l Typical application:
Micro-optics
MEMS (pressure sensor, accelerometer...)
Wafer level packaging (image sensor package...)
Bioengineering (microfluidics, DNA analysis...)
PLC wafer cover
And many other customer-specific applications.

Technical parameter:
a) Material: BOROFLOAT®33, PYREX7740, quartz glass, Corning Eagle-XG, B270, D262T, AF32,Soda lime
b) Standard thickness: 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.7mm, 1.0mm, 1.5mm (thickness tolerance ± 0.02mm)
c) Standard size: Φ2", Φ3", Φ4", Φ5", Φ6", Φ8", Φ12" (other sizes can be customized)
d) Appearance: 60/40
e) Surface roughness (Ra) <1.5nm
f) Parallelism <0.01mm
g) Each edge is blunt C0.05~0.2mm
h) Crack <0.2mm, not crackable
i) The surface is clean and must not be imprinted or stained. It is packaged under a clean workbench and packaged in a special box.