China Syj-800 Sample Cutting Dicing Saw for Lab

Model:
SYJ-800 Cutting/Dicing Saw
Brief Introduction:
SYJ-800 Cutting/Dicing Saw is mainly used for dicing and cutting all kinds of crystal, glass, ceramic, mineral, metal. It can realize the computer 3D automatic control. Dicing crystal wafer's diameter can reach to 200mm, cutting accuracy can reach to 0.02mm. It's one of the best precision cutting saw for lab and factory's manufacturing.
Main
Feature:
1. Single board computer and normal computer can be used to control this machine, allowing user to program, manual cutting and dicing.
2. 0.5 hp high torque brushless DC motor, can reach to 0-3000 r/min,voltage: 110V-220V.
3. PC controlled stepping motor driving resolution 0.0025mm,position accuracy 0.01mm.
4. Manual control / Automatic digital control by control box .Equip with exquisite sample spinning platform, can turn 360°, cutting angle tolerance + /-0.5° .
5. Equip with precision φ200mm vacuum chuck, andφ200mm glass or ceramic resin sample holder.
6. Suited blade and blades clamp can be choice according to cutting materials' dimension.
7. Water-proof system and splashing protection,throttle valve adjust the cutting liquid flow.
Technical
Parameter:
No.
Item
Technical Standard
Unit
1
Principal axis drive power
0.5
p
2
Principal axis rotating speed
0-3000
r/min
3
X-axis travel distance
205
mm
4
Y-axis travel distance
205
mm
5
Z-axis travel distance
70
mm
6
Processing wafer thk.
0.05-2.5
mm
7
Cutting max depth
10
mm
8
Operating platform turn angle and turn angle error
360±0.01
(°)
9
Stepping motor resolution
0.0025
mm
10
Stepping motor position accuracy
0.01
mm
11
Dia.Sample Holder
200
mm
12
Dia.Vacuum chuck
200(8inch)
mm
13
Blade outside diameter
Dicing blade 86,cutting blade 100
mm
14
Blade inside diameter
12.7
mm
15
Voltage
220
V
Specification:
700mmx530mmx750mm
More Information



Contact Person: Ichuka Lang