T-962C infrared bga Reflow Oven, automatic PCB Soldering Machine T-962c
1 - Technical parameters
Soldering area: 400*600mm
Overall dimensions: 68*50*17.5cm
Power: 2500W
Cycle time: 1-8 min
Voltage: AC110V-AC220V /50-60HZ
2 - FEATURES
(1) A large infrared soldering area
Soldering area: 400*600mm; This increases the usage range of this machine drastically and makes it an economical investment.
(2)Eight soldering temperature waves
Parameters of eight soldering waves are predefined and the entire soldering process can completed
Automatically from Preheat, Soak and Reflow through to cool down.
(3) Special heat up and temperature equalization with all designs
Uses up to 1500 Watts of energy efficient Infrared heating and air circulation to re-flow solder.
(4) Ergonomic design, practical and easily operated
Good build quality but at the same time light weight and a small footprint allows the T962C to be easily
Bench positioned transported or stored.
(5) Large number of available functions
The T962C can solder single and double-sides PCB boards, for example CHIP, SOP, PLCC, QFP, BGA etc. It is the ideal rework solution from single runs to on-demand small batch production.
3 - Warranty
Warranty the main body maintains for one year and the spare parts maintains for three months.
Service provide the immediate network online Q/A and the technical advisory work service