Cog Medium Size Automatic Bonding Machine for Acf Attachment of IC and LCD

M-8300C COG medium size automatic bonding machine
Usage:M-8300C COG automatic bonding machine is mainly used in the ACF attachment of IC and LCD, IC automatic suction, alignment, pre-bonding and bonding as one of the automatic bonding equipment.AdvantagesCompared with traditional machines:Multistage and multilateral crimping;Capable of corresponding to two kinds of IC at the same time;ACF automatic attachment and image detection system;Capable of bonding multiple of IC at the same timeAutomatically photographing and alignment, drawing, flipping for IC.
Compared with competitor:Optional number of bonding part, whose distance is adjustable;Cartridge-type loading system of IC;Portable tape optional system;Casting high rigidity structure.
CHARACTERISTICS:High precision: Equipped with high-precision image correction system and high rigidity structure. Through the servo and PLC control, the machine runs stably;High efficiency: Equipped with high-speed servo motor to improve the alignment accuracy and production regularity;High automation: LCD automatic loading device, ACF automatic detection system and IC cartridge-type device.
TECHNICAL PARAMETER
AccuracyX:± 3um Y:± 3umDemands for factoryThree phase 380V±10%,50Hz,8000W Working air pressure:0.45~0.7Mpa (dry air source) Working mode2ACF+1 Pre-bonding+4 bonding, Thermostatic heating method T/T3 S(single IC)ObjectsLCD: 3.94 inches to 22.57 inchesDimensions (LxWxH)2500L)x1450(W) x1800(H)mm Weight2800kg