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Copper Molybdenum (Cu-Mo) Heat Sink Composite Materials

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Min. Order / Reference FOB Price
100 Piece	US $1.00/ Piece

Local Area:	Beijing, China
R&D Capacity:	OEM, ODM, Other
Payment Terms:	LC, T/T

Product Type:	Heterotype
Material:	Mocu
Density:	9.80g/cm3

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Product Description

Mo-Cu composite is similar with Tungsten-copper composite, its thermal expansion
coefficient and thermal conductivity can be adjusted to match many different
materials, it has lower density, but its CTE is higher than W-cu.MarkWt% MolybdenumWt% CopperDensity (g/cm3)
at 20ºCThermal conductivity at 25ºCCoefficient of thermal expansion at 20ºCMo85Cu1585±0.2rest10160-1806.8Mo80Cu2080±0.2rest9.9170-1907.7Mo70Cu3070±0.2rest9.8180-2009.1Mo60Cu4060±0.2rest9.66210-25010.3Mo50Cu5050±0.2rest9.54230-27011.5These composite are widely used in applications, such as, optoelectronics packages
Microwave Packages, C Packages, Laser Sub-mounts, etc.