Cu-Mo-Cu (CMC) Sandwich Heat Sink of Electronic Packing Materials

Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two
copper clad layers. It has tailorable CTE, high thermal conductivity and high st
All types of Cu/Mo/Cu sheets can be stamped into components.The features of copper molybdenum copper:-Large sized sheets available (length up to Xxmm, width up to Xxxmm)
-Can be stamped into components
-Strong interface bonding resist to 850'cheat shock repeatedly
-ailorable CTE matching that of semiconductor and ceramic materials
-High thermal conductivity
MarkDensity(g/cm3)at 20ºCCoefficient of thermal expansiont 20ºCThermal conuctivity at 25ºC
In-planeThermal conuctivity at 25ºC
thru-thicknessCu13Mo74Cu139.885.6200170Cu1Mo4Cu19.756.0220180Cu1Mo3Cu19.666.8244190Cu1Mo2Cu19.547.8260210Cu1Mo1Cu19.328.8305250Applications are similar with W-cu composites
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages.
GaAs device mount.