Glid Copper Heat Sink Electronic

Glid Copper refers to a family of Copper-based metal matrix composite(MMC)
alloys mixed primarily with aluminum oxide ceramics particles. The addition of
small amounts of aluminum oxide has minuscule effects on the performance of
the copper at room temperature(such as a small decrease in thermal and electrical
conductivity), but greatly increases the copper's resistance to thermal softening
and enhances high elevated temperature strength Glid has higher hardness value
(Hvs125)and tensile strength(350 Mpa), compared to OFCS HV40 and 250 Mpa.
The addition of aluminum oxide also increases the thermal conductivity or electrical
conductivity is required while also maintaining strength at elevated temperatures
or radiation levels.Product Properties:
MarkMelting pointSoftening temperatureDensity(g/cm3)Coefficient of thermal Thermal conductivity
Density expansion at 20ºCThermal conductivity at 25ºCC157151083ºC800ºC8.8417.6x10-6/K365W/M.K.
-Additional material and elements can be added if lower thermal expansion is required
or higher room temperature and elevated temperature strengths. The hardness can
also be increased-A composite material of Glid AL-60 and 10% Niobium provides high strength and high conductivity.-The hardness is comparable to many copper-beryllium and copper-tungsten alloys,
while the electrical conductivity is comparable to RWMA Class 2 all.