Heat Sink Materials Tungsten, Tungsten Copper, Molybdenum Copper

Of all matals in pure from,tungsten has the highest melting point,lowest vapor pressure and the highest tensile strength.It is the ideal material for ultra high temperature and high vacuum applications.
Tungsten has the lowest coefficient of thermal expansion(CTE)of any pure metal,its CTE match well with semiconductor material,such as Si,GaN,GaAs,Al2O3,and it is stable at high temperature,make it the ideal material for electronic packaging and seals.
Tungsten has a lower electrical resistivity than other refractory metals,but it will increase with temperature,this property is critical for high temperature furnace applications.
DensityMelting pointCTE(20-2000ºC)Thermal Conductivity19.3g/cm33410ºC±204.67μm.m-1 k-1167W/m.m-1 k-1
Prue tungsten products are widely used for furnace parts,Semicouctor base plates,components for electron tubes,emission cathodes for electron beam evaporation,cathodes and anodes for ion impiantation,tubes/boats for sintering of capacitiors,targets for X-ray diagnostics,crucibles,heating elements,X-ray radiation shielding,sputtering targets and electroders.