Professional PCB with Competitive Price LED SMT Board Assembly

ShenzhenShi LvMeiJinYu Electronics Co.,Ltd Founded in 2005 and headquartered in Shenzhen, LM devotes to technology innovation and covers industries of telecommunication,power, security, Optronics, industrial control, medical, Auto product, comsumer electronics, etc., 40% product for oversea market of South America, Europe, Japan, India, Middle East, etc.. Each year, we complete thousands of successful assignments, this volume creates market knowledge that allows us to seize opportunities, speed the business process and create the most thorough, precisely accurate picture of PCB & related industries conditions and trends. Every day, in markets around the globe, we apply our insight, experience, intelligence and resources to help customers make informed PCB & related services/products decisions.
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1. Process capacity
Process Capability And Checking Parameters(Hard Board)NOITEMTechnical Capabilities1Layers2-58L ,68L for samples2Max.Board Size1200*610mm48"*24"3Finished Board Thickness0.2mm--10.0mm,17.5mm for samples0.008"--0.4"4Finished Copper Thickness17um-420um0.5OZ--12OZ5Min.Trace Width/Space0.075mm/0.065mm0.003"/0.0026"6Min.Hole Size0.15mm0.006"7Hole Dim. Tolerance(PTH)±0.05mm±0.002"8Hole Dim.Tolerance(NPTH)±0.05mm±0.002"9Drill Location Tolerance±0.05mm±0.002"10V-Cut Degrees20-90ºC20DEG-90DEG11Min.V-Cut PCB Thickness0.4mm0.016"12N/C Routing Tolerance±0.1mm±0.004"13Min.Blind/Buried Via0.15mm0.06"14Plug Hole Size0.2mm--0.6mm0.008"--0.024"15Min.BGA PAD0.2mm0.008"16MaterialsFR4,Aluminium,High Tg,Halogen-free,Rogers,ShengYi,KB17Surface FinishLF-HAL,ENIG,ImAg,ImSn,OSP,Gold plating,ENIG+OSP,HAL+G/F18Warp & Twist≤0.75%19Electrical Testing50--300V20Solderability Testing245±5ºC,3sec Wetting area least95%21Thermal Cycling Testing288±5ºC,10sec,3cycles22Ionic Contamination TestingPb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm23Soldmask Adhesion Testing260ºC+/-5, 10S,3timesProcess Capability - Technical Parameters(FPC)ContentCommonSpecialSurface treatmentThicknessMinimum line width0.07mm0.05mmElectroplated nickel goldNi:3-9um;Au:0.03-0.1umMinimum line spacing0.07mm0.05mmMinimum Drilling apertureΦ 0.15mmΦ 0.1mmAperture Tolerance±0.1mm±0.05mmChemical immersion goldNi:3-5um;Au:0.03-0.1umMaximum imposition size (single panel)610mm*1200mm(Exposure limit)250mm*35mm(only develop test samples)Maximum imposition size (double panel)610mm*1200mm(Exposure limit)250mm*35mm(only develop test samples)Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid)610*1650mmElectroplated hard goldNi:2-9um;Au:0.1-0.3umFinished board impedance tolerance±10%Electroplated pure tinSn:3-7umMaximum production layer12LThickness To Diameter Ratio2:1(Minimum aperture 0.1mm)5:1(Minimum aperture 0.2mm)Anti-oxidation8:1(Minimum aperture 0.3mm)Monthly production capacity/m²16000 m²MaterialSubstrate MaterialPI(0.5mil,1mil,2mil),PET(0.5mil,1mil)Conductive MediumCopper foil(1/3oz,1/2oz,1oz,2oz)ConstantanSilver PasteCopper InkAdhesiveEpoxy resin, Acrylic, AdhesionSolder Mask / Protective FilmPI(0.5mil,1mil,2mil)(Yellow, White, Black)PET(1mil,2mil)Solder mask (green, yellow, black...)Glue3M467,3M468,3M9077,TESA8853...Reinforcement TypePI,FR4,PET,Steel,Aluminum...
2. Lead Time
3. Stack-Up4.Product Type
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