Professional SMT Aluminum LED SMT PCB Assembly

Shenzhen LvMeiJinYu Electronic Co.,Ltd
Founded in 2005 and headquartered in Shenzhen, LM devotes to technology innovation and covers industries of telecommunication,power, security, Optronics, industrial control, medical, Auto product, comsumer electronics, etc., 40% product for oversea market of South America, Europe, Japan, India, Middle East, etc.. Each year, we complete thousands of successful assignments, this volume creates market knowledge that allows us to seize opportunities, speed the business process and create the most thorough, precisely accurate picture of PCB & related industries conditions and trends. Every day, in markets around the globe, we apply our insight, experience, intelligence and resources to help customers make informed PCB & related services/products decisions
Take advantage of our strength and experience and allow us to help you maintain your competitive edge. we are well positioned to support our customers through the entire product life cycle, from concept to volume production.
1.Detailed Specification of PCB Manufacturing1Layer1-30 layer2MaterialFR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum3Board thickness0.2mm-7mm4Max.finished board side500mm*500mm5Min.drilled hole size0.25mm6Min.line width0.075mm(3mil)7Min.line spaceing0.075mm(3mil)8Surface finish/treatmentHALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating9Copper thickness0.5-4.0oz10Solder mask colorgreen/black/white/red/blue/yellow11Inner packingVacuum packing,Plastic bag12Outer packingStandard carton packing13Hole tolerancePTH:±0.076,NTPH:±0.0514CertificateUL,ISO9001,ISO14001,ROHS,CQC15Profiling PunchingRouting,V-CUT,Beveling16Assembly ServiceProviding OEM service to all sorts of printed circuit board assembly
2.Detailed Terms for Pcb AssemblyTechnical RequirementProfessional Surface-mounting and Through-hole soldering TechnologyVarious sizes like 1206,0805,0603 components SMT technologyICT(In Circuit Test),FCT(Functional Circuit Test) technologyPCB Assembly With UL,CE,FCC,Rohs ApprovalNitrogen gas reflow soldering technology for SMTHigh Standard SMT&Solder Assembly LineHigh density interconnected board placement technology capacityQuote&Production RequirementGerber File or PCB File for Bare PCB Board FabricationBom(Bill of Material) for Assembly,PNP(Pick and Place file) and Components Position also needed in assemblyTo reduce thequote time,please provide us thefullpart number for each components,Quantity per board also the quantity for orders.Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rateOEM/ODM/EMS ServicesPCBA,PCB assembly: SMT & PTH & BGAPCBA and enclosure designComponents sourcing and purchasingQuick prototypingPlastic injection moldingmetal sheet stampingFinal assemblyTest: AOI, In-Circuit Test (ICT), Functional Test (FCT)Custom clearance for material importing and product exportingOther PCB Assembly EquipmentsSMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4Reflow Oven: FolunGwin FL-RX860Wave Soldering Machine: FolunGwin ADS300Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing ServiceFully Automatic SMT Stencil Printer: FolunGwin Win-5
3.Production Details:
1) Material Management
Supplier → Components Purchase → IQC → Protection Control → Material Supply → Firmware
2) Program Management
PCB Files → DCC → Program Organizing → Optimization → Checking
3) SMT Management
PCB Loader → Screen Printer → Checking → SMD Placement → Checking → Air Reflow → Vision Inspection → AOI → Keeping
4) PCBA Management
THT→Soldering Wave (Manual Welding) → Vision Inspection → ICT → Flash → FCT → Checking → Package → Shipment