Quality Prototype FPC Flexible Copper Circuit Printed Board Technologies

Product Description
Name:FPC Process Capability
Number of LayersSingle Sided, Double Sided, Multilayer,Rigid-flex PCB
based MaterialPI, PET
Certificate:
OHSAS18001:2007,ISO14001:2004,ISO/TS16949:2009,
ISO13485:2003,TUV,UL,SGS,ROHS,FCC,CCC,CE,ASTM-F963-16Custom Made:OEM/customizeFlexiblelayers1~8layerMinimumTraceandSpace12&18um(baseCu):0.075/0.075mm;35um(baseCu):0.1/0.1mmMinimumSpaceBetwen

CoverlayOpenings

0.2mmMinimumSpacebetween

coverlayandsolderpad

0.15mmPolyimideFilms0.5mil(12.5),1mil(25),2mils(50),3mils(75),

4mils(100),5mils(125)ascustmerrequested

ThermobondAdhesivesAcrylic/ModifiedAcrylic,ModifiedEpoxy,PolyimideCopperFoils(RAorED)1/3oz(12),1/2oz(18),1oz(35),2oz(70)SurfaceFinishElectrolessNi/Au,Electrolyticsoft/hardgold,

Tinplating,,Imm.Tin,Entek/OSP

SolderResistsCoverlay,Photo-ImagableResistCopperPlatedThickness(PTHonly)8~15um;20~30um;30~70um(special)Minimumspacebetween

coverlayandconductor

±0.15mmMinimumconductoredgeto

outlineedge

≥0.1mmAuthickness

Electroless Ni/Au Ni:2~6um;Au:0.035~0.075um

Electrolyticsoft/hardgoldNi:2~9um;Au:0.035~0.1um

SmallestDrillSize0.2mmLargestDrillSize6.3

A blend of rigid and flex emphasizing the best of both constructions, adding complimenting capabilities that neither possess alone. In its most typical configuration, the rigid-flex is as a series of rigid PCBs joined by integrated flex circuits (with emphasis on the high percentage of rigid area content). There are many excellent possibilities for circuits designed primarily as a flex circuit with the addition of integrated rigid areas. The rigid areas provide excellent hard mount points for components, connectors and chassis while flex areas offer dynamic flexing, flex to fit, and component mounting poised to take advantage of these low mass and vibration resistant zones. This blending leads to creative solutions for your most demanding applications.

Multilayer flex circuits offer exceptional performance and reliability in situations where the circuit is exposed to excessive vibration or shock combined with frequent bending or folding. Multilayer technology allows high circuit density connections to be achieved in applications where one or two layers of conductors could not meet the required circuit packaging requirements. Additionally, multilayer flex circuits provide increased functionality with a smaller footprint.

We have three companies,more than 500 workers in it.Our companies are specialized in the production of membrane switch,nameplate,lenses,crystal glue Acrylic craftwork,cartoon frameand so on.We have large dust-free workshop,full automatic silk screen printing machine,colorprinting machine,CNC engraving and milling machine,numerical control cutting machine,punchandsomeothermodernproductiondevices.BT,,SEMTECH,Emerson,Delong,FerroliMotorola,Haier,Electrolux,Guangbao are all our cooperate partners. We are authorized by such as China famous quality products,quality service productsAAAenterprise,OHSAS18001:2007,ISO14001:2004,ISO/TS16949:2009ISO13485:2003,TUV,UL,SGS,ROHS,FCC,CCC,CE,ASTM-F963-16.I can assure you of our best qualitly. Look forward to cooperating with you .