Thermal Shock Test Chamber, Temperature Shock Test Chamber

Thermal shock test chamber (3-Zones Thermal shock test chamber)
Product purposeThe equipment is suitable for each kind of electronic product and other product; and the parts and materials are subjected to high/ low temperature constant and each kind of temperature impact and temperature quick change reliability test.
Technical Parameters ofthermal shock test chamberModelKTS-41AKTS-41BKTS-41DKTS-71AKTS-71BKTS-71CKTS-110AKTS-110BKTS-110DKTS-301AKTS-301BKTS-3011DTemperature range of test chamber+60~+200°C+60~+200°C+60~+200°C+60~+200°C-40~+0°C-55~+0°C-65~+0°C-40~+0°C-55~+0°C-65~+0°C-40~+0°C-55~+0°C-65~+0°C-40~+0°C-55~+0°C-65~+0°CCooling modeWind cooling or water cooling optionalTemperature recovery conditionHigh temperature exposure + 150ºC 30minNormal temperature exposure5 minLow temperature exposure-40ºC 30min-55ºC 30min-65ºC 30min-40ºC 30min-55ºC 30min-65ºC 30min-40ºC 30min-55ºC 30min-65ºC 30min-40ºC 30min-55ºC 30min-65ºC 30minTemperature recovery time5 minInner size (mm)W240410650970H460460460460D370370370670External size (mm)W13001300150015001720172020502050H19001900190019001900190019001900D17001800170018001800190021002200Sample2.5KG5KG10KG24KGPowerAc380±10% three phase and four wire protection ground wire) / AC220V /AC110 50Hz / 60HZCompressed air0.4~0.7MPaWater pressure0.2~0.5MPa
Reference Standards
*GB/T2423.1-2008 Test A: Low Temperature Test Method;
*GB/T2423.2-2008 Test B: High Temperature Test Method;
*GB/T2423.22-2002 Test N: Low Temperature Test Method;
*GJB150.3-1986 High Temperature Test;
*GJB150.4-1986 Low Temperature Test;
*GJB150.5-1986 Temperature Shock Test.What we can support:
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