Tungsten-Copper (W-Cu) Electronic Packing Component Heat Sink

W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivityproperties, and the tungsten and copper in the thermal expansion coefficient andthermal conductivity can be adjusted with the W-Cu composition, also the compositecan be machined to various shape, these features make the application of thiscomposite with great convenience. The thermal expansion can be adjusted to matchwith the following materials:(1) Ceramic materials: Al203(A-90, A-95, A-99), BeO(B-95, B-99), AIN, etc(2) Semiconductor materials: Si, GaAs, SiGe, SiC, GaP, GaAs(3)metal Material: Kovar alloy (4J29), 42 alloy;The quality of our composite is the leader in China, contributed with our strict qualitycontrol measures. Our porosity is very low, our surface/volume ratio(measured withBET) is only 50% of similar products in the market. based on the measurements of100 pieces of 5*5*2 mm W80-Cu20 composite). Our products have high hermeticityand can pass the He mass-spectrometor leak test (< 5*10A-9 Pa/S).Our Tungsten Copper Composite Features
-No Fe, Co, Ni, Mn and other elements addeled as the sintering activator, to maintain a high thermal conductivity.
-Excellent hermeticity
-Can provide semi-finished or finished (Ni/Au plated)products
-Precision machining and excellent dimensional control, surface finish and flatness
-With close technical supports including product design, custom manufacturing testing and post sale supportsPhysical Properties of Major ProductsMarkWt%(W)Wt%(Cu)Density
at 20ºCThermal conductivity at 25ºCCoefficient of thermal expansion at 20ºCW90Cu1090±1rest17.0g/cm3180-1906.5W85Cu1585±1rest16.4g/cm3190-2007.0W80Cu2080±1rest15.6g/cm3200-2108.3W75Cu2575±1rest14.9g/cm3220-2309.0W50Cu5050±1rest12.2g/cm3310-34012.5
These composite are widely used in applications,such as optoelectronics packages,Microwave Packages,C Packages,Laser Sub-mounts,etc.