UL E344718 Single Side Aluminum LED PCB

Hangzhou Dejia Electronics has passed ISO9001:2008 Quality System Certification, UL and TS16949 Certification, ISO14001 Environment Certification while our products meet RoHS Directive. We operate under ISO9001:2008 Quality System Certification strictly integrating fine management into every production step to ensure our product quality ahead of others in this field.
Our company manufacture massively by mature technology products as follows: streetlight aluminum PCB, fluorescent lamp aluminum PCB, wash wall light aluminum PCB, spotlight aluminum PCB, bulb light aluminum PCB, tunnel lamp aluminum PCB and other aluminum PCBs. So far our business has reached over ten provinces and cities in China; abroad we have clients from America, England, Germany, Turkey, Malaysia, Russia, Japan, Brazil and many other countries.
In June 2012, our company took the first place to bring out 3D bending aluminum PCB widely used in LED lighting, car lamp, backlight and such areas bringing new revolution. The main consumers of 3D bending aluminum PCB were CREE, GE, Volkswagen, Audi, BOE, Topstar, ETi and such famous enterprises at home and abroad.
Nowadays materials used by our company are from Microtek, Juding, Quanbao, Dupon, Beggs and such high-end materials able to manufacture products with coefficient of heat conductivity from 0.5W to 4.0W and to satisfy clients' needs both at home and abroad.Alu-PCB(MCPCB)CapabilityNo.ItemCapabilities1Layers 1-2 Layers 2Finished Thickness 16-134Mil (0.4MM-3.4MM )3Max. Dimension500MM *1200MM 4Material TCB-2AL,CS-AL-88/89,EM-MP,HA80,NRK,JHAF02-1.0,3D Bending,Copper base,DJ-A115Finished Thickness Tolerance ≤1.0MM ±0.10MM -1.6MM ±0.15MM6Min.Line Width&Spacing4Mil (0.1MM )7Copper Thickness 35um, 70um,1 to 10oZ8Min. Finished Hole Size0.95MM 9Min. Drill Size1.00MM 10Max. Drill Size6.5MM 11Finished Hole Size Tolerance ±0.050MM12AperturePosition Precision ±0.076MM13Warp & Twist0.75%14Min SMT PAD Size 0.4MM±0.1MM15Min.Solder Mask PAD0.05MM(2Mil)16Min.Solder Mask Cover0.05MM(2Mil)17Solder mask Thickness >12um18Min.Solder MaskBridge0.1MM(4Mil)19Surface Finishing HAL,HALLeadfree,OSP, Immersion Gold, etc20HAL Thickness5-12um21Immersion Gold Thickness1-3 Microinch22OSP Film ThicknessENTEK PLUS HT:0.3-0.5um; F2:0.15-0.3um23V-CUT Angle 30°,45°,60°24V-CUT Thickness 0.4-3.4MM25V-CUT Precision ±0.05MM, Up&Down Cut Deviation
±0.05MM,Residual Thickness ±0.05MM26Outline Finishing Routing & Punching; Precision Deviation ±0.10MM27E-test Voltage 250 ± 5V28E-test Resistance 10Ω-100MΩ29Peel Strength 288°, 30s ≥1.430Thermal Conductivity 1.0to 12W/m.k31Withstand Voltage AC:1KVto 6.5KV, DC:1KVto 8.5KV32Thermal Stress 288°,30s Non-LayeredNo Foaming