Applications of Furnace:This furnace is designed for thick film products firing, such as Hybrid IC, chip-R, SMD components terminal, LTCC, Stainless steel heater, PV thin film cell and other similar products.
Features of Furnace: Use infrared tube in drying section, and infrared FEC heating board in firing section.
Specification | HSK8006-1511Z Drying and Firing furnace | Rate Temperature1050 deg. cOperation TemperatureRT~950 deg. cBelt Width800mm/31.5"Control Zones15SpeedRange50-400mm(1.9" -15.7" )/minOutside DimensionL14585mm/574" x W1500mm/59" x H1450mm/57"Net Weight5800kgPowercustomer requireSpare PartHeating Board 1 Suit,
SolidStateRelay 1 PEC