China Laser Cutting System for Flexible Printed Wiring Boards

1. Usage
Precisive cutting of FPC and organic membrane covering board without molds or the protection plate. High-energy laser source and precise control of laser beams can improve the processing speed and the accuracy of processing results. It has all the functions same as the one produced by LPKF but price is lower.
2. Characteristic
2.1. Independent intellectual property rights of the control software, Humanized interface, complete functions and simple operation.
2.2. Processing any graphic, cutting different thickness and different materials, stratified processing and complete synchronously
2.3. Adopt high-performance ultraviolet light laser with short wave length, high beam quality and higher peak power properties. Because ultraviolet light is through decomposition, vaporization instead of melting to cutting the materials, so almost no burrs after processing, small thermal effect, no stratification, precise cutting effects, smooth, steep sidewall.
2.4. Fixed sample by using Vacuum mode, without matrix protection plate, convenient and improving the processing efficiency.
2.5. Used for a variety of substrate materials cutting, such as: Silicon, ceramics, glass, etc.

2.6. Automatic correction, automatic positioning and multi board cutting function. Automatic board thickness measurement and compensation. Full stroke motor compensation function. Improved cutting accuracy, reduced horizontal vibration. Improved depth cutting accuracy. Improved efficiency in cutting complex patterns.

3.Specifications

Item SpecificationMODELJG18Laser Source355nm All-solid-state UV laser cutting device,wavelength 355nmLaser Power10WMaximum Processing Size,720mmx540 mm(21″x28″)XY Platform Maximum Operating Speed50m/minPositioning accuracy±3µmRepeat accuracy±1µmSystem Processing Precision±20µmGalvanometer scanning range50mm X 50mm Cutting Thickness≤1mmPowerAC 220V/50Hz/2.2KW;380V/50Hz/5.5KWVacuum Requirements516m3/hOverall Dimensions1818mmx2317 mmx1550 mmWeight3500kgEnvironmental Temperature20ºC±1ºCHumidity<60%RH (No dew)Ground Amplitude<5µmVibration Acceleration<0.05GGround Pressure2200kgf/m2Industry-specific control machine, computer equipped flexible processing softwareMotion control card and industry machine control mode
100G
Equipped with 17 screens, 100G hard disk
standard G code, Gerber data, CAD-compatible

4.Video at YouTube

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5.Please let us know following informations:
1.What kind of material do you want to cut?
2.What is the mostly used thickness and what is the maximum thickness?
3. What is the MAX. dimension of your materials ?
4. Are you an end user or reseller?
According to your above information,we'll recommend the most suitable machine to you.